Press Release Summary:
PrintPlusÂ® P530 printing series and SolderPlusÂ® D550 dispensing series consist of lead-free solder pastes with clear, colorless, no-clean flux residue that allows solder joints to be used in applications requiring shiny, cosmetic finish. Easing inspection and optimizing wetting capabilities, products are suited for SMT, mechanical, electronic, and electro-mechanical soldering applications.
Original Press Release:
Improved Lead-free SAC 305 No-clean Formulation
Lincoln, RI USA - EFD, Inc. Solder Paste Group introduces an improved no-clean solder paste product family specifically formulated for SAC 305. Lead-free formulations are known to leave dull, matte finishes, but the new clear, colorless no clean flux residue allows the solder joint to sparkle; perfect for applications requiring a shiny, cosmetic finish. Ease inspection and improve wetting capabilities with this new flux formulation for SMT, mechanical, electronic and electro-mechanical soldering applications.
For more information or to request an evaluation sample of PrintPlus® P530 printing series or SolderPlus® D550 dispensing series solder paste contact an EFD solder paste specialist at 1-800-338-4353, or visit their web site at: www.efdsolder.com, a comprehensive source for soldering process innovations.