Solder Mask is suited for LDI applications.
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Press Release Summary:
Used for designs that need laser direct imaging, Model LDI-1000 GA solder mask requires 80 mJ/cm² of exposure energy and provides coatings up to 65 microns in thickness. RoHS compliant product meets low halogen standards and is compatible with final finishes including electroless nickel/immersion gold, silver, and tin. Solder mask is heat resistant and is compatible with lead-free assembly.
Original Press Release:
LDI-1000 GA
Taiyo America, Inc., Carson City, NV announces LDI-1000 GA, a new laser direct imageable solder mask. LDI-1000 GA is a high productivity solder mask, designed specifically for LDI applications and requires only 80 mJ/cm² of exposure energy. It resolves fine features in coatings up to 65 microns in thickness. LDI-1000 GA has excellent heat resistance, and is compatible with lead-free assembly. It also is RoHS compliant, meets industry standards for low halogen and is compatible with final finishes including electroless nickel / immersion gold, silver and tin. "LDI-1000 GA is a state of the art product for the most demanding designs that require laser direct imaging. It utilizes conventional solder mask equipment for coating and processing after laser exposure to minimize modifications to the conventional solder mask process in the shop" says Jody Williams, New Product Development Manager for Taiyo America.
