Press Release Summary:
Featuring semi-automatic design, Auto Dip can process single board or pallets up to 19.3 x 12.5 in. in 2-12 sec. Boards are placed on fixtureless ultra-fine needle bed, which retains PCBs without components being dislodged when dipped into solder bath. Solder is evenly applied while surface tension floats boards at correct wetting height, and built-in motorized skimmer removes dross as needed. Adjustments exist for dwell time, temperature from 220-299 CÂº, and dipping angle.
Original Press Release:
Manncorp's 'Auto-Dip' Performs High-Throughput Lead-Free Mass Soldering
"Auto Dip," a compact semi-automatic lead-free solder dipping machine, capable of processing a single board or pallets of up to 490 x 320mm (19.3" x 12.5") in just 2 to 12 seconds, is now available from Manncorp.
"Auto Dip will fill the void for PCB assemblers who don't require the speed of a wave machine, but are ready to step up from labor-intensive manual soldering," states Henry Mann, CEO.
Boards are placed on a fixtureless ultra-fine needle bed, which retains PCBs without the components being dislodged when dipped into the solder bath. Solder is evenly applied while surface tension "floats" the boards at correct wetting height. Activation is controlled by microprocessor at adjustable intervals, or by foot pedal. A built-in motorized skimmer removes dross as needed. Adjustments also exist for dwell time, temperature from 220º to 299 Cº, and dipping angle. Start-up and shut-down times are also controllable and can be preset for up to one week.
Auto Dip is Insta-Quote priced at $6,155. For details, access manncorp.com or firstname.lastname@example.org.