Press Release Summary:
Offering optimal drop shock performance without compromisesÂ to thermal cycling, SACM™ has lead-free composition and consists of 97.5–98.5% Sn (tin), 0.5–1.0% Ag (silver), 0.5–1.0% Cu (copper), and dopant levels of Mn (manganese). Alloy is doped with manganese, which increases strength, while reduced silver content promotes stable cost structure. Properties include 5,625 psi tensile strength, 3,590 psi yield strength, 2110 King's Modulus (KSI), and 15.7% elongation.
Original Press Release:
Indium Corporation's SACM(TM) Provides Superior Drop Shock Performance AND Thermal Cycling Reliability
Indium Corporation's new SACM™ is a high-reliability solder alloy that offers drop shock performance far superior to other SAC alloys, without compromising on thermal cycling – all at a cost below that of typical SAC solder alloys.
SACM™ meets the electronics assembly market’s demand for a solder alloy that offers the combination of good drop shock performance, good thermal cycling, lead-free composition, and reduced cost.
The invention of SACM™ offers superior drop shock performance versus SAC305 and SAC105, with the added benefit of thermal cycling reliability equivalent to SAC305. This provides manufacturers with an affordable high-reliability SAC alloy. This development is especially meaningful for the manufacture of consumer electronics that normally see frequent handling, such as mobile devices.
SACM™ is doped with manganese and contains less silver than other Pb-free alloys. Manganese provides increased strength and the reduced silver content provides a more stable cost structure, especially beneficial for cost-sensitive applications.
According to Tim Jensen, global product manager for Indium Corporation’s PCB assembly products, “SACM provides manufacturers with a Pb-free alloy that offers greatly-improved reliability, while helping to control the cost volatility associated with traditional SAC alloys.”
Indium Corporation is a premier materials supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputtering targets; indium, gallium, and germanium metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium Corporation has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation’s SACM™ solder paste, visit www.indium.com/SACM or email firstname.lastname@example.org.