SOIC Adapters upgrade older relays.

Press Release Summary:



Offered with 8 leads, SOIC Adapters are .062 in. thick FR-4 with 1 oz of copper traces on both sides. They are available on .300 in. DIP centers and can be mounted on PCBs with hole diameter of .028 in. Pins are 360 ½ hard brass alloy, and pin plating is 5.08 µm minimum tin/lead 93/7 over 2.54 µm minimum nickel. Adapters provide upgrade from older Aromat HB2E relays to surface-mount TXSS relays while keeping same PCB layout. Max operating temperature is 221°F.



Original Press Release:



Aries Now Offers New SOIC Adapter for Cost-Effective Upgrades from Older Relays



Frenchtown, NJ, April 2004 - Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, now offers SOIC adapters that quickly and cost effectively provide an upgrade from older Aromat HB2E relays to surface mount TXSS relays while keeping the same PBC layout.

Available on .300" (7.62 mm) DIP centers, the new adapter can be mounted on PCBs with a PCB hole diameter of .028" +/-.003" (.71 mm +/-.08 mm). The adapters are available with 8 leads.

The adapters are constructed of .062" (1.57 mm) thick FR-4 with 1 oz. of copper traces on both sides. The pins are 360 ½ hard brass alloy, per UNS C36000 ASTM-B16085, and pin plating is 200µ (5.08µm) minimum tin/lead 93/7, per MIL-P-81728 over 100µ (2.54µm) minimum nickel, per QQ-N-290. Operating temperature is 221°F (105°C).

Pricing for 1000 pieces is $5.40 each with delivery from stock to three weeks.

For additional information, contact Aries Electronics, Inc., P.O. Box 130, Frenchtown, NJ 08825. Tel: 908/996-6841; Fax: 908/996-3891; E-mail: info@arieselec.com; Web: www.arieselec.com, Data sheet #18086 Rev. C www.arieselec.com/products/18086.pdf

Headquartered in Frenchtown, NJ, Aries Electronics, Inc., manufactures an extremely broad range of custom and standard interconnection and packaging products for electronics. Industry leading products include Zero Insertion Force (ZIF) test sockets for DIP, PGA, PLCC and SOIC devices; the Correct-A-Chip(TM) product line of "intelligent connectors"; adapters and connectors; several patented concepts for BGA (ball grid array) and LGA (land grid array) sockets; and an extensive array of high frequency test and burn in sockets. The company also specializes in meeting custom requirements for its customers.

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