Software targets CMOS modeling foundries.
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Press Release Summary:
Designed for use with Integrated Circuit Characterization and Analysis Program device modeling software, BSIM3 Model Extraction Package employs physical-based extraction steps rather than manual tuning and enables modelers to characterize full CMOS process in 2 days. Program also uses graphical and analysis tools to boost efficiency. Customizable architecture allows user to optimize extraction flow for specific process to achieve maximum accuracy during subsequent extractions.
Original Press Release:
Agilent Technologies' BSIM3 Model Extraction Package for CMOS Modeling Foundries Now Available
SANTA CLARA, Calif., April 19, 2007 -- Agilent Technologies Inc. (NYSE: A) today announced shipment of the enhanced BSIM3 Model Extraction Package for use with Agilent's Integrated Circuit Characterization and Analysis Program (IC-CAP) device modeling software. The new BSIM3 package contains the same speed and efficiency featured in the newer BSIM4 and PSP extraction modules and can also reduce CMOS device model extraction times from weeks to days.
IC-CAP software is used by semiconductor foundries to accurately characterize foundry processes. It is the first modeling software tool with a comprehensive extraction methodology for all three of the standard CMOS device models: BSIM3, BSIM4 and PSP. Although the more advanced BSIM4 and PSP CMOS models are used today for sub-micron MOS processes, the simpler BSIM3 model is still widely used for large volume and less advanced MOS applications.
"A delay or mistake in providing an accurate model in this area can be very costly when modeling groups are under pressure to deliver quality BSIM3 models on time," said Roberto Tinti, product marketing manager with Agilent's EEsof EDA division. "We've made an ongoing investment in the BSIM3 Model Extraction Package because our customers continue to benefit from its effectiveness."
The new BSIM3 package completes a comprehensive Agilent suite of CMOS modeling solutions that includes the BSIM4 and the most recent PSP Modeling Extraction Packages. It includes an extraction technology that employs physical-based extraction steps rather than time-consuming and unreliable manual tuning. With the BSIM3 package modelers can characterize a full CMOS process in just two days, down from an average industry time of 10 days. The BSIM3 package also uses a variety of advanced graphical and analysis tools to boost efficiency. Customizable architecture allows the user to optimize the extraction flow for a specific process to achieve maximum efficiency and accuracy during subsequent extractions.
Additional information about the IC-CAP software and available extraction packages is available at www.agilent.com/find/eesof-iccap.
A high-resolution image of Agilent's BSIM3 model extraction package is available at www.agilent.com/find/eesof-BSIM3_image.
More information about all of Agilent's EDA software offerings is available at www.agilent.com/find/eesof.
U.S. Pricing and Availability
The Agilent BSIM3 Model Extraction Package is available now as a downloadable update to the current IC-CAP 2006B release, with prices starting at approximately $22,000.
About Agilent Technologies
Agilent Technologies Inc. (NYSE: A) is the world's premier measurement company and a technology leader in communications, electronics, life sciences and chemical analysis. The company's 19,000 employees serve customers in more than 110 countries. Agilent had net revenue of $5.0 billion in fiscal year 2006. Information about Agilent is available on the Web at www.agilent.com.
