Software enables IC package creation.

Press Release Summary:



Flopack v3.1 web-based SmartPart library enables creation of IC packages and associated parts. Parts created within Flopack can be imported into Flomerics' Flotherm software. Features include corporate multi-user function; range of DELPHI compact models for Cavity-down PBGA, TBGA, and ChipArray families; and JEDEC Test Environment Wizard. Version 3.1 includes separate input fields for solder mask below die.



Original Press Release:


Flomerics Further Enhances Productivity Of IC Design Engineers With Flopack Version 3.1


Southborough, Massachusetts, March 2002. Flomerics has further enhanced the productivity of IC Design Engineers with the launch of Flopack v3.1 (www.flopack.com) - the latest version of its web-based SmartPart library for the fast, accurate and reliable creation of IC packages and associated parts. Parts created within Flopack can then be instantly imported into Flomerics' Flotherm software developed to analyze the cooling requirements of electronic components and systems. New features contained within Flopack v3.1 include a corporate multi-user function that allows internal workgroups to share the same designs so avoiding duplication; an extended range of DELPHI(1) compact models for Cavity-down PBGA(2), TBGA(3) and ChipArray families; and a new JEDEC(4) Test Environment Wizard, that guides Engineers through the creation of standard test environments determined by JEDEC and allows them to import designs directly into Flotherm.

Other features include a Flip-Chip PBGA SmartPart Upgrade, that enables users to define more of the complex details that make up the substrate of the Flip-Chip PBGA package and a significant upgrade to the Wire-Bonded PBGA SmartPart library including separate input fields for the solder mask below the die and an option to selectively disconnect thermal vias from one or more metal layers in the substrate.

Commenting on Flopack v3.1, Sarang Shidore, Director of Web Business, Flomerics, said, "Providing Design Engineers with productivity gains is the driving force behind all of Flomerics' products. Flopack v3.1 achieves this by improving the speed and consistency of IC package thermal analysis and by making it even easier for those people who are not usually involved with IC package design to realize substantial improvements in productivity."

Annual licenses for Flopack start at $3.500 USD. Annual licenses for Flotherm start at $19,500.

Further information on Flotherm and Flomerics Thermal Design Services can be obtained from Sherman Ikemoto, Director of Marketing, Tel: 408-562-9100, Email: sherman.ikemoto@flomerics.com, Website: www.flomerics.com

(1) DELPHI - EC funded project entitled DEvelopment of Libraries of PHysical Models for an Integrated design environment
(2) PBGA - Plastic Ball Grid Array
(3) TBGA - Tape Ball Grid Array
(4) JEDEC - The JEDEC Solid State Technology Association (Once known as the Joint Electron Device Engineering Council), is the semiconductor engineering standardization body of the Electronic Industries Alliance (EIA), a trade association that represents all areas of the electronics industry

Issued: Ends Ref: F1249.doc

About Flomerics
Flomerics Group plc was formed in 1988, and is a world-leading player in the rapidly-expanding field of "virtual prototyping" - the provision of software enabling engineers to test virtual models of their equipment on a computer before building physical prototypes. Flomerics' business model, "Design-Class Analysis", is drastically different from traditional analysis. Design-Class Analysis focuses on real engineering design problems, and selects the appropriate analysis techniques to solve them as quickly and simply as possible. Flomerics is currently focused on three main technical areas and markets: a) thermal management of electronics; b) electromagnetic design for electronic, antenna and microwave devices; and c) heating and ventilating of buildings. For more information, visit: www.flomerics.com or contact Sherman Ikemoto, Director of Marketing, Tel: 408-562-9100. Email: sherman.ikemoto@flomerics.com.

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