Press Release Summary:
Able to dissipate up to several watts without extra heat sinking, SG-BGA-8000 socket is designed for 31 mm package size and operates at bandwidths up to 10 GHz with less than 1 dB of insertion loss. It handles up to 100 W with custom heat sink and offers typ contact resistance of 23 mW per pin. Applicable for BGA pitches from 0.8-1.27 mm, socket connects all pins and optional center power pad and offers pin inductance of 10.15 nH and capacitance to ground of 0.10 pF.
Original Press Release:
High Performance, 10 GHz Socket Technology for 1.0mm Pitch BGA Packages
Socket your BGA packages without significant performance loss and with minimal increase in PC Board footprint
BURNSVILLE, MN - June, 2007 - Ironwood Electronics has recently introduced the new high performance BGA socket for 1.0mm pitch BGA. The SG-BGA-8000 socket is designed for a 31mm package size; operate at bandwidths up to 10 GHz with less than 1dB of insertion loss. The sockets are designed to dissipate up to several watts without extra heat sinking and can handle up to 100 watts with custom heat sink. The contact resistance is typically 23 milliohms per pin. The socket connects all pins and the optional center power pad with 10+ GHz bandwidth on all connections.
The SG-BGA-8000 is constructed with high performance and low inductance elastomer. The temperature range is -35 C to +85 C. The pin inductance is 10.15 nH. Capacitance to ground is 0.10 pF. The socket accommodates IC packages such as the IDT 31x31mm, 1mm pitch FCBGA. Simply attach the socket to the PCB, drop in chip, place easy install swivel lid. This socket technology, applicable for BGA pitches from 0.8 to 1.27mm, allows these pitch BGA's to operate to over 10 GHz without significant contactor loss.
Pricing for the SG-BGA-8000 is $1,361 at qty 1 with reduced pricing available depending on quantity required.
11351 Rupp Dr.
Burnsville, MN 55337
Tel: 952-229-8200 or (800) 404 - 0204