SMT PCB Connector enables data rates up to 10 Gbit/sec.
Press Release Summary:
Featuring blind-mate design for mezzanine card applications, 1.0 mm pitch system MicroSpeed connector is available in 50 signal contact modules and is designed to be used in multiples between two parallel cards without mating issues from negative tolerance stack up. It is available in 16 different stack heights or board-to-board heights from 5-20 mm with every height in between in 1 mm increments. Male and female connectors are supplied in tape-on-reel packaging.
Original Press Release:
ERNI Electronics Offers Blind-Mate MicroSpeed Connector
Blind-mate designs ensure robust connection
Adelberg, November 11, 2008 - ERNI Electronics has expanded its MicroSpeed family to include a new Blind-Mate version for mezzanine card applications. The MicroSpeed connector is a 1.0-mm pitch system using SMT technology for data rates up to 10Gbit/s. The MicroSpeed is available in 50 signal contact modules and is designed to be used in multiples between two parallel cards without mating issues from negative tolerance stack up. The MicroSpeed design advantage allows many smaller connectors to be used to shorten PCB traces, reduce PCB layers and even improve system airflow by providing a narrow profile. Two rows of 50 signal contacts with perimeter shielding present an 'open pin field' design suitable for differential and single-ended requirements.
The new Blind-mate designs have integrated guide pins with higher displacement tolerances to stop incorrect, forced connections. Reinforced housing side walls absorb the larger forces that may result from virtual "blind mating" to prevent connector damage while providing a positive connection. This characteristic offers advantages specifically with larger, heavier PCBs which can be connected without additional board guides. MicroSpeed Blind-mate will initially be introduced in the standard height of 1 mm for the male connectors and 4 mm for the female parts for a combined 5 mm board-to-board height. Additional heights of the MicroSpeed Blind-mate as well as additional heights of the MicroSpeed PowerModule are planned. Please contact ERNI Electronics for additional information.
The SMT or SMT/THR version ensures fully automatic processing using the conventional SMT assembly and reflow-soldering process. The longitudinal pitch of MicroSpeed connectors is 1 mm and the transverse pitch is 1.5 mm (for impedance purposes). Differential signal pairs can be arranged horizontally or vertically. Optimized crosstalk behavior is achieved with a parallel configuration of the signal pairs (in the longitudinal direction) and the pairing arrangement of signal and shield contact pairs.
The standard MicroSpeed is available in 16 different stack heights or board-to-board heights from 5 mm up to 20 mm with every height in between in just 1 mm increments. Yet all these heights are achieved by 'mixing and matching' four different male and four different female connectors. At the same time, the perimeter shielding provides robust SMT or THR mechanical strain relief for the most reliable soldering experience possible. MicroSpeed male and female connectors are supplied in tape-on-reel packaging. Additional design features for fully automatic assembly are: Black insulating bodies made of LCP for fast and reliable visual recognition as well as a pre-mounted placement aid for easy gripping.
DemoBoards, SPICE models and an evaluation kit are available for the MicroSpeed connectors.
About ERNI Electronics
ERNI Electronics is a leading global manufacturer and worldwide supplier of a broad line of interconnects for the telecommunications, data communications, computer, industrial and medical markets. ERNI has manufacturing operations in Europe as well as sales offices in over 40 countries. ERNI products are also marketed via a worldwide network of representatives and leading distributors. Further information is available at www.erni.com.
