Press Release Summary:
Designed for home and professional audio amplifiers, 2SA2151, 2SC2151A, 2SC6011, and 2SC6011A utilize thinner-die technology technique to promote power-up by minimizing thermal resistance and maximizing voltage avalanche breakdown rating. Power-handling capacity of TO-3P package (160 W) contributes to smaller space for circuit design. While suitable for multi-channel applications for AV amplifiers and receivers, products also serve parallel connection applications for PA amplifiers.
Original Press Release:
Allegro® Announces Two New Single Transistors for Audio Amplifiers
Worcester, MA, January 25, 2007 - Allegro® MicroSystems, Inc. announces two new transistors targeted at the home and professional audio amplifiers markets. These two new devices utilize a thinner-die technology technique to achieve improved power-up by decreasing thermal resistance, and by providing a higher voltage avalanche breakdown rating.
The high power-handling capacity of the TO-3P package contributes to a smaller space for circuit design. This series is highly suitable to not only multi-channel applications for AV amplifiers and receivers, but also parallel connection applications for PA amplifiers.
These devices have a 10 to 12 week lead-time to market. Pricing in 1K quantities is detailed below:
o 2SA2151: $1.50
o 2SC2151A: $1.60
o 2SC6011: $1.50
o 2SC6011A: $1.60
Allegro MicroSystems, Inc. is a global leader in the development, manufacture and marketing of high-performance power integrated circuits and integrated Hall-effect magnetic sensors. Allegro's innovative, system-level solutions serve high-growth applications within the automotive, computer/office automation, industrial, consumer and communications markets. With more than 2,500 employees, Allegro is headquartered in Worcester, MA. Further information about Allegro can be found at www.allegromicro.com.