SFP Transceiver provides 40 km data link over single fiber.
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Press Release Summary:
Suited for high-speed datacom applications, 2.5 Gb/s hot pluggable SFP Transceiver features upstream 1,310 DFB laser and downstream 1,490 PIN/TIA receiver. Bi-directional, optical transceiver is based on SystemOnGlass(TM) technology, which consists of mountable glass chip that integrates commercial laser diodes, photodiodes, and minimum number of electronic and electro-optic components using no free space elements.
Original Press Release:
ColorChip's Announces 2.5Gb/s Bi-directional SFP Transceiver
OFC 2009, SAN DIEGO, California, March 23// -- ColorChip, a leading developer of breakthrough technology for the fiber optics industry, today announced its 2.5Gb/s bi-directional transceiver. The new hot pluggable SFP transceiver provides up to 40Km data link over a single fiber.
"We are exited about the new pluggable transceiver which at first enables to use our PLC chip based technology for high speed datacom applications," said Moshe Price , CEO of ColorChip. "This will pave our way to provide more pluggable products for datacom centers and Metro applications."
The new transceiver is a single fiber Diplexer optical transceiver with an upstream 1310nm DFB laser and a downstream 1490nm PIN /TIA receiver. The new product- is based on ColorChip's breakthrough SystemOnGlass(TM) (SOG(TM)) technology. This first-of-its-kind system introduces a mountable glass chip that integrates commercial laser diodes, photodiodes and a minimum number of electronic and electro-optic components using no free space elements.
ColorChip's new wafer scale photonics packaging approach is made possible by the company's Ion-Exchange PLC waveguides technology. The technology, which enables simplified Photonic Integration Circuitry (PIC) into optical network terminals ( ONT /ONU), offers a small form pluggable (SFP) transceiver with an unusual level of reliability, exceptionally high yield, scalability due to fully automated manufacturing, which is designed for maximum functionality for cost-conscious OEMs.
ColorChip will exhibit in booth #2940 at the OFC/NFOEC 2009, March 22-24, 2009, at the San Diego Convention Center, California.
About ColorChip
ColorChip (http://www.color-chip.com) is a privately held company that designs, develops and markets innovative components and modules for the fiber optic access and datacom telcos and OEMs. The Company's products are based on its Ion-Exchange on glass and the revolutionary SOG (TM) (SystemOnGlass (TM) ) technologies. ColorChip provides PLC splitters, integrated SOG FTTx transceivers,Datacom transceivers and other customized sub systems PLC products. The company's technologies assures complete reliability, high level of scalability, while enabling a minimal number of components and substantial reduced footprint.
For more information, visit www.color-chip.com .
