SFF Ruggedized PC/104-Plus SBC leverages Intel Atom CPU.

Press Release Summary:




Supporting Intel® Atom(TM) CPUs from 1.66 GHz N450 to dual-core D510 and up to 2 GB DDR2 667 MHz RAM, Ampro by ADLINK(TM) CoreModule® 745 offers thermal design power as low as 9 W and enables conduction-cooled solutions for space-constrained applications. I/O interfaces, along with 16-bit ISA bus and 32-bit PCI bus, include 2 RS-232 ports, RS-232/422/485 port, GbE port, and 8 GPIO. Operating from -40 to +85°C, stackable SBC withstands vibration to 11.95 Grms and shock to 50 Grms and has 4 GB SSD.



Original Press Release:



ADLINK Presents an Extreme Rugged(TM) PC/104-Plus Single Board Computer with Intel® Atom Processor



The full featured, multi-core capable CoreModule® 745 delivers the next step forward in rugged, low power embedded systems and stackable platforms

San Jose, CA - ADLINK Technology Inc. announces the release of its newest small form factor (SFF) rugged single board computer (SBC), the Ampro by ADLINK(TM) CoreModule® 745. The CoreModule® 745 is a PC/104-Plus module that continues ADLINK's ongoing investment in the PC/104 marketplace. Supporting a range of Intel® Atom(TM) processors from the power efficient N450 running at 1.66GHz to the performance oriented dual-core D510, the CoreModule® 745 takes advantage of Atom's two-chip solution architecture with integrated memory and graphics controllers to balance excellent performance with very low power requirements. With a TDP as low as 9W, the CoreModule® 745 simplifies cooling requirements and enables conduction cooled solutions for small sealed enclosures in space-constrained applications.

Rugged by design, the CoreModule® 745 supports a wealth of legacy I/O interfaces including ISA and PCI buses. Serial ports, one GbE port and up to 2GB of DDR2 667MHz RAM are also incorporated into an expanded PC/104 footprint. This stackable PC/104-Plus SBC allows OEMs in military, avionics, transportation and other rugged markets to add a state-of-the-art Intel® Architecture controller to their systems without the need for a custom carrier board. The CoreModule® 745 also provides a simple upgrade path for the broad base of existing PC/104 system designs.

"Our customers depend on ADLINK to provide the latest technology as well as legacy support in a ruggedized format that will operate under the most demanding environmental conditions," said Brian Healy, Product Management Manager of ADLINK. "The CoreModule® 745 with Intel® Atom(TM) processor combines an amazing range of I/O and computing capabilities for our OEMs that are developing products for zero-fail applications. With the CoreModule® 745, ADLINK once again meets the demanding requirements of military, transportation, avionics, factory floor, and other rugged and extended temperature applications."

About the CoreModule® 745
The CoreModule® 745 is a PC/104-Plus SBC developed with the Ampro by ADLINK(TM) Extreme Rugged(TM) design methodology, enabling operation at temperatures from -40°C to +85°C, vibration up to 11.95Grms, and shock up to 50Grms. With a 4GB solid state drive soldered onboard, the CoreModule® 745 is a complete solution with no moving parts, satisfying military and aerospace requirements for missions in the most extreme environments. The CoreModule® 745 also features a full 16-bit ISA bus, PCI 32-bit bus, one GbE port, two RS-232 serial ports, one RS-232/422/485 port, four USB 2.0 ports and eight GPIO. In addition, the CoreModule® 745 offers excellent graphics performance with an LVDS panel interface and legacy CRT support. For harsh environments, optional conformal coating is offered.

The CoreModule® 745 is available now in production quantities with QuickStart Kits including cables, 2GB DDR2 RAM, device drivers and board support packages (BSPs) for many popular operating systems including VxWorks®, Windows® CE, Windows® XP Embedded, Linux® and QNX.

For more product information, please visit: http://www.adlinktech.com/ampro-extreme-rugged.

About ADLINK
ADLINK Technology provides a wide range of embedded computing products and services to the test & measurement, automation & process control, gaming, communications, medical, network security, and transportation industries. ADLINK products include PCI Express®-based data acquisition and I/O; vision and motion control; and AdvancedTCA, CompactPCI, and Computer-on-Modules (COMs) for industrial computing. With the acquisition of Ampro Computers, Inc., ADLINK also provides a wide range of Extreme Rugged and Rugged Single Board Computers, Computer-on-Modules and Systems under the brand name Ampro by ADLINK. ADLINK strives to minimize the total cost of ownership (TCO) of its customers by providing customization and system integration services, maintaining low manufacturing costs, and extending the lifecycle of its products. ADLINK is a global company with headquarters and manufacturing in Taiwan; R&D and integration in Taiwan, China, and the US; and an extensive network of worldwide sales and support offices.

ADLINK is ISO-9001, ISO-14001, and TL9000 certified, is an Associate Member of the Intel® Embedded Alliance, an Executive Member of PICMG, a Sponsor Member of the PXI Systems Alliance, and a Member of the AXIe Consortium. ADLINK is a publicly traded company listed on the TAIEX Taiwan Stock Exchange (stock code: 6166).

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