SFF Rugged SBC is suited for military/portable computing.
Press Release Summary:
Based on ULP Intel® Atom(TM) Z510 (1.1 GHz) or Z530 (1.6 GHz) processor, CoreModule® 730 integrates multiple PCIe lanes, USB 2.0 interfaces, LPC bus, I²C bus, and SPI bus in 90 x 96 mm ISM(TM) form factor. It also features SUMIT(TM) expansion interface along with Gigabit Ethernet and Compact Flash interfaces. Additional support is provided for DDR2 533 SODIMM RAM (2 GB max), IDE interface, 8 GPIO, and integrated graphics engine.
Original Press Release:
ADLINK Revolutionizes Rugged Small Form Factor (SFF) Computing with the CoreModule® 730 SBC
First to market from a leading multi-national supplier with the ground-breaking SUMIT(TM) interface in 90x96 mm ISM(TM) form factor, CoreModule® 730 ushers in a new 'Atomic' Era of Rugged Computing
San Jose, Calif, March 31, 2009 - ADLINK Technology Inc., a leading global provider of trusted embedded products, today announced the biggest architectural innovation in small form factor (SFF) rugged single board computers (SBCs) since the PC/104 bus was invented by Ampro in 1992. The new CoreModule® 730 embedded processor, based on the ultra low power Intel® Atom(TM) Z510 and Z530 processors at 1.1 and 1.6 GHz, respectively, sets a new efficiency standard for tiny rugged computers by using the new SUMIT(TM) expansion interface. It reinvents stackable and mezzanine architectures by packing an enormous amount of data bandwidth and easy connectivity - including multiple PCI Express(TM) lanes, USB 2.0 interfaces, LPC bus, I2C bus, and SPI bus - into a fraction of the space previously occupied by only the 33 MHz parallel PCI-104 bus.
With PCI Express, Gigabit Ethernet, USB 2.0 ports, and a Compact Flash socket, the CoreModule 730 features the lowest-power Intel chipset available, the US15W "Poulsbo" chipset, to round out the "Menlow" platform at only 5 W for 1.1 GHz. Conductive cooled solutions are also easy to implement for small sealed boxes with no internal air flow. This announcement means that system OEMs in military, avionics, transportation, data logging, portable computing and other rugged markets can add a state-of-the-art Intel® Architecture controller to their systems without a custom carrier board design.
"While many board manufacturers require their system OEM customers to design custom carriers or use two-board solutions in order to take advantage of their Atom-based computer-on-module (COM) products, ADLINK offers CoreModule 730 as a true single-board solution, ready to run with simple cables," said Colin McCracken, product director for ADLINK's embedded computer division. "By departing from space-inefficient pin-in-socket expansion with parallel buses, CoreModule 730 will bring stackable SBCs into new application areas. Even after the merger, ADLINK continues to build upon Ampro's reputation and tradition of pioneering modular small form factor technologies for high-reliability and long lifecycle embedded markets."
About the CoreModule® 730
The CoreModule 730 is the first SUMIT-ISM(TM) product on the market. SUMIT(TM) is the new standard expansion interface from the Small Form Factor Special Interest Group (SFF-SIG), www.sff-sig.org. ISM(TM) stands for Industry Standard Module, and is a 90x96mm form factor that specifies a board outline and mounting holes and is completely flexible in terms of expansion interfaces. ISM is also defined by the SFF-SIG. CoreModule 730 offers a choice of 1.1 GHz and 1.6 GHz Atom(TM) processors, US15W chipset, DDR2 533 SODIMM RAM up to 2 GB, Gigabit Ethernet, four USB 2.0 ports, IDE interface, Compact Flash socket, 8 general-purpose I/O pins (GPIOs), and integrated graphics engine with H.264 decode acceleration, analog VGA output and 18-bit / 24-bit LVDS interface for LCD displays.
Price and Availability
The CoreModule® 730 SBC starts at around $400 in OEM quantities and is sampling within 30 days.
About ADLINK
ADLINK Technology provides a wide range of embedded computing products and services to the test & measurement, automation & process control, gaming, communications, medical, network security, and transportation industries. ADLINK products include PCI Express®-based data acquisition and I/O; vision and motion control; and AdvancedTCA, CompactPCI, and Computer-on-Modules (COMs) for industrial computing. With the acquisition of Ampro Computers, Inc., ADLINK also provides a wide range of Extreme Rugged and Rugged Single Board Computers, Computer-on-Modules and Systems under the brand name Ampro by ADLINK. ADLINK strives to minimize the total cost of ownership (TCO) of its customers by providing customization and system integration services, maintaining low manufacturing costs, and extending the lifecycle of its products. ADLINK is a global company with headquarters and manufacturing in Taiwan; R&D and integration in Taiwan, China, and the US; and an extensive network of worldwide sales and support offices.
ADLINK is ISO-9001, ISO-14001, and TL9000 certified, is an Associate Member of the Intel® Embedded and Communications Alliance, an Executive Member of PICMG, and a Sponsor Member of the PXI Systems Alliance. ADLINK is a publicly traded company listed on the TAIEX Taiwan Stock Exchange (stock code: 6166).
