Set Top Box Chip features channel bonding technology.
Press Release Summary:
Supporting up to 120 Megabits/sec downstream data rates, Model BCM3255 enables media centers to support all-IP network platform. Channel bonding combines several DOCSIS® 3.0 channels together to accelerate data rates when compared to cable modems. Chip integrates 800 DMIPS processor, three 1024/256 QAM in-band demodulators, out-of-band demodulator, DOCSIS 2.0+/3.0 cable modem technology, USB 2.0 MAC and PHY, and 10/100 Fast Ethernet MAC and PHY.
Original Press Release:
Broadcom Announces Industry's First Front-End Cable TV Set-Top Box Chip With Integrated Channel Bonding Technology
New Channel Bonding Technology Dramatically Increases Cable TV Transmission Speed, Opening the Door for New Cable IP Services
LAS VEGAS, 2006 International CES, Jan. 5 - Broadcom Corporation (NASDAQ:BRCM), a global leader in wired and wireless broadband communications semiconductors, today announced the industry's first front-end cable TV set-top box chip with integrated channel bonding technology. Channel bonding is a DOCSIS(R) 3.0 feature that dramatically increases the transmission speed of a cable TV network, enabling multi service operators (MSOs) to migrate to an all- Internet Protocol (IP) network platform. Addressing voice, video and data, the all-IP network enables MSOs to provide significant benefits such as additional cable and local broadcast channels, content flexibility and improved network efficiency.
Channel bonding combines several DOCSIS channels together to significantly increase data rates when compared to the speed of today's cable modems. Announced today is the new Broadcom(R) BCM3255 set-top box chip that incorporates this channel bonding technique. This new chip can support up to 120 Megabits per second (Mbps) downstream data rates, enabling next generation media centers to support an all-IP network platform, such as Comcast's RNG family of devices. Moving to an all IP-based platform for voice, video, and data content helps to decrease MSOs network operating costs while enabling the network to support fast high-definition video downloads, high bit rate services and other IP voice and video services.
"Increasing the speed and performance capabilities of the cable network is a key element for MSOs as more and more telecommunications operators install fast, fiber-to-the-curb networks," said Daniel Marotta, Senior Vice President and General Manager of Broadcom's Broadband Communications Group. "Our new cable TV set-top box chip sets a benchmark for the industry enabling MSOs to deploy new set-top boxes and media centers today that can support the transition to an all-IP network."
"Channel bonding is a key technology that will enable Comcast to continue our migration to an IP Platform," said David Fellows, Comcast Cable CTO. "The integration of channel bonding in silicon, like the Broadcom solution, is a significant step towards combining the power of DOCSIS and IPTV."
Broadcom designed its new BCM3255 set-top box chip to interface with its BCM7400 dual high-definition (HD) advanced video coding (AVC)/VC/MPEG-2 decoder chip. The BCM7400, also announced today, is a single-chip backend solution that supports the latest video compression technologies, including AVC (the ITU and ISO joint standard) and VC-1 (the Society for Motion Picture and Television Engineers or SMPTE standard) for HD programming.
The BCM3255 and BCM7400, when combined with multiple BCM3420 tuners, provide manufacturers with a complete HD AVC, digital video recording (DVR) cable TV media center design that can support channel speeds of up to 120 Mbps with multiple HD AVC streams, advanced downloadable conditional access system (DCAS) security features, up to 1600 DMIPs processing power, and a complete home networking management package. Broadcom packaged this complete solution into the BCM7400CAB reference design to provide its customers with a turnkey solution for next generation set-top box designs.
Product Information
The BCM3255 is a highly integrated front-end chip for HD DVR cable TV set-top boxes and media centers. The chip integrates three 1024/256 QAM in-band demodulators, an out-of-band demodulator, DOCSIS 2.0+/3.0 cable modem technology, USB 2.0 MAC and PHY, and a 10/100 Fast Ethernet MAC (media access controller) and PHY (physical layer device). An integrated 800 DMIPS processor provides support for these next generation features including DOCSIS 2.0+/3.0 and channel bonding resequencing, DOCSIS set-top gateway (DSG) protocols, as well as networking protocol support for TCIP, IPnP and IPv6.
The BCM3255 set-top box chip can be configured to operate with current video channels or in a channel bonding mode. Using Broadcom developed software, cable engineers can remotely switch between the two modes, making the chip ideal for current broadcast solutions as well as for future channel bonded IP-based networks.
Pricing and Availability
The BCM3255 is available today in sample quantities. The chip is packaged in a 416-pin PBGA and is priced at $32 each in 10,000 piece quantities.
Broadcom's Broadband Business Group
Broadcom offers manufacturers a range of broadband communications and consumer electronics SoCs that enable voice, video and data services over residential wired and wireless networks. These highly integrated silicon solutions continue to enable the most advanced system solutions on the market, which include digital cable, satellite and IP set-top boxes and media servers, broadband modems and residential gateways, high definition and digital televisions, HD DVD players and personal video recorders.
About Broadcom
Broadcom Corporation is a global leader in wired and wireless broadband communications semiconductors. Our products enable the convergence of high-speed data, high definition video, voice and audio at home, in the office and on the go. Broadcom provides manufacturers of computing and networking equipment, digital entertainment and broadband access products, and mobile devices with the industry's broadest portfolio of state-of-the-art system-on-a-chip and software solutions. These solutions support our core mission: Connecting everything(R).
Broadcom is one of the world's largest fabless semiconductor companies, with annual revenue of more than $2 billion. The company is headquartered in Irvine, Calif., with offices and research facilities in North America, Asia and Europe. Broadcom may be contacted at 1-949-450-8700 or at www.broadcom.com.
Broadcom(R), the pulse logo, Connecting everything(R), and the Connecting everything logo are among the trademarks of Broadcom Corporation and/or its affiliates in the United States certain other countries and/or the EU. DOCSIS(R)is a trademark of Cable Television Laboratories, Inc. Any other trademarks or trade names mentioned are the property of their respective owners.
CONTACT: Press, Laura Brandlin, Director, Marketing Communications,
+1-949-926-5108, lbrandlin@broadcom.com, or Technical, Peter Schenitzki, Product Marketing Manager, +1-949-926-5252, peters@broadcom.com, all of Broadcom Corporation
