Press Release Summary:
Suitable for just about any electrical/electronic component including printed circuit boards, Low-Pressure Injection Process uses molten thermoplastic polyamide hotmelt for overmolding. In many production situations, it offers alternative to epoxy or urethane fillers or conformal coating and is suitable for temperature-sensitive and complex shaped parts that need environmental protection against dust, oil, chemicals, and jostling.
Original Press Release:
Custom Low Pressure Injection Overmolding For PCB & Electronic Components
Englewood, NJ - March 2, 2007 - APM HEXSEAL announced today their new custom over molding sealing capability for just about any electrical/electronics component including printed circuit boards. Using molten thermoplastic polyamide hotmelt, the low-pressure injection process tenaciously adheres to most substrates including PVC wires. In many production situations LPIO is a superior, low-cost alternative to
epoxy or urethane fillers or conformal coating and is ideal for temperature-sensitive and complex shaped parts that need environmental protection against dust, oil, chemicals and jostling. LPIO is safe and easy to implement with pressures as low as 20 psi, eliminating the possibility of component damage associated with traditional high-pressure injection molding.
About APM HEXSEAL Custom Molding Division --- For more than half a century APM has specialized in developing custom environmental sealing solutions using a wide variety of elastomeric materials for industry and the military. Other divisions produce seals for electro-mechanical switches and circuit breakers and self-sealing fasteners with threadlocking options.
For more information contact:
44 Honeck Street
Englewood, NJ 07631