SerDes Device supports high-speed data bus applications.

Press Release Summary:



Qualified to MIL-PRF-38535 Class V, 1.6-2.7 Gbps TLK2711HFGQMLV Serializer/Deserializer is suited for high-speed backplane interconnect and point-to-point data link applications. Radiation-hardened unit provides 2.5 Gbps I/O data channels for baseband data transmission over controlled impedance media of approximately 50W. Transmission media can be PCB, copper cables or fiber optic cable. Unit uses 2.5 V power supply and draws less than 500 mW.



Original Press Release:



Texas Instruments Introduces the Radiation Hardened QMLV TLK2711 SerDes Device for Use in Ultrahigh-Speed Bidirectional Point-to-Point Data Transmission Systems



DALLAS (July 13, 2006) -Texas Instruments Incorporated (TI) (NYSE: TXN) announced today the release of the TLK2711HFGQMLV 1.6 to 2.7 Gigabits per Second (Gbps) Serializer/Deserializer. A member of the WizardLink family of multigigabit transceivers, the device is qualified to MIL-PRF-38535 (QML) Class V and is designed to support serial interface in high speed data bus applications for aerospace equipment, such as satellites. (See:http://ti.com/qmlvtlk2711).

Ideal for High-Speed Backplane Interconnect and Point-to-Point Data Link, the TLK2711HFGQMLV provides very high-speed (2.5 Gbps) I/O data channels for baseband data transmission over controlled impedance media of approximately 50W. The transmission media can be printed-circuit board, copper cables, or fiber-optic cable. With a 2.5V power supply and drawing less than 500mW, the device offers a lower power solution to other parallel data transmission architectures.

The TLK2711HFGQMLV can also be used to replace parallel data transmission architectures by providing a reduction in the number of traces, connector terminals, and transmit/receive terminals. Parallel data loaded into the transmitter is delivered to the receiver over a serial channel, which can be a coaxial copper cable, a controlled impedance backplane, or an optical link. It is then reconstructed into its original parallel format.

Packaging and Availability
The TLK2711HFGQMLV is offered in the high-performance 68-lead Ceramic Quad Flat Package (HFG). Currently, the TLK2711HFGQMLV is a convenience part number and the device is orderable to a DSCC SMD part number (5962-0522101VXC) with radiation data available. Samples are currently available and order entry is open with initial production units available in October.

As satellite systems, space flight, and exploration requirements continue to outgrow the available space level component technologies. The industry needs greater performance, lower power, higher integration levels and cost effective solutions. Texas Instruments' Hi-Rel group has chosen to support the demanding nature of space applications through MIL-PRF-38535 QML Class V products.

About Texas Instruments
Texas Instruments Incorporated provides innovative DSP and analog technologies to meet our customers' real world signal processing requirements. In addition to Semiconductor, the company includes the Educational & Productivity Solutions business. TI is headquartered in Dallas, Texas, and has manufacturing, design or sales operations in more than 25 countries.

Texas Instruments is traded on the New York Stock Exchange under the symbol TXN. More information is located on the World Wide Web at www.ti.com

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