Semiconductor Test Probe meets HED device testing challenges.

Press Release Summary:

With 5.0 mm test height that provides total compression window of 0.8 mm and insertion loss of 18 GHz @ -1 dB (GSG), ZIP™ semiconductor test probe model Z-080YHJ targets high-lead count BGAs and LGAs and meets challenges associated with testing High End Digital (HED) devices. DUT side plunger, which is made from HyperCore™ homogenous alloy, features sharp, dual tip geometry for facilitated penetration of solder ball oxides. Product is based on flat probe technology.

Original Press Release:

Meeting the Challenges of Cost-Efficient Testing High-End Digital Devices

Everett Charles Technologies introduces new member of the ZIP probes family: Z-080YHJ

Fontana, California – Everett Charles Technologies (ECT) launched a new member of the versatile ZIP™ semiconductor test probe family. The Z-080YHJ is designed to meet the many challenges associated with testing High End Digital (HED) devices. ZIP probes are a cost effective solution that provide excellent mechanical reliability and electrical performance.

Tony DeRosa, Senior Product Manager points out: “High lead count packages require a large compression window to compensate for package co-planarity stack-up errors. In addition, these devices often require a high level of signal integrity which is typically in the 12GHz+ range. These requirements result in conflicting physical parameters. A large compression window increases the length of the probe while high bandwidth drives probe length to as short as possible.”

The Z-080YHJ’s 5.0mm test height provides a generous total compression window of 0.8mm. The probe also provides an insertion loss of 18GHz @ -1dB (GSG). These factors combined make Z-080YHJ a perfect solution for HED applications. The Z-080YHJ is scaled for 0.8mm and greater device pitches and targets high lead count BGA’s and LGA’s. The DUT side plunger is made from ECT’s durable HyperCore™ homogenous alloy. This along with its sharp dual tip geometry allows penetration of solder ball oxides with less force than standard 4-point crown tips.

ZIP probes are based on ECT’s patented, innovative flat probe technology. The manufacturing process used to fabricate ZIP probes is extremely repeatable and results in a high level of consistency from probe lot to lot. Other ZIP probes target RF, mixed signal and general purpose semiconductor test applications.  Markets served include burn-in, lab testing and high volume production.  Low cost and high performance are hallmarks of ZIP probes.

To learn more about ECT’s probes for semiconductor test please visit

About Everett Charles Technologies (ECT):

ECT (headquartered in Fontana, CA) is the world's leading manufacturer of POGO ® contact probes for a wide range of applications including industrial, medical, military, connectors and testing bare and loaded printed circuit boards. R&D programs address engineering and materials issues that will affect Contact Solutions for the next decade. Methods for maintaining electrical continuity in miniature probes, improved spring technologies, and probe head geometries are under continual review. ECT POGO ® contacts are marketed worldwide through sales offices in the United States, Europe and Asia. ECT is a company of Xcerra™ Corporation, which provides capital equipment, interface products, and services to the semiconductor, industrial, and electronics manufacturing industries. Xcerra Corporation offers a comprehensive portfolio of solutions and technologies, and a global network of strategically deployed applications and support resources. Additional information can be found at and

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