Press Release Summary:
- Creates a centrifugal force that causes solder paste to repeatedly fold over itself
- Features auto balance function that works with 500g to 1 kg containers
- Enables user to condition solder paste from the refrigerator to being prepared for production in about 10 minutes
Original Press Release:
Seika Offers New MALCOM SPS-10 Solder Paste Softener
TORRANCE, CA — February 2019 — Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, is pleased to introduce the new SPS-10 Solder Paste Softener from MALCOM.
MALCOM has introduced a new version of its proven solder paste softener that has been in use for many years. The updated system can now store up to nine condition settings, and the digital timer can be set in ten second intervals.
The SPS-10 creates a centrifugal force that causes the solder paste to repeatedly fold over itself, thereby softening the paste and using friction to bring it up to room temperature. The system’s auto balance function will work with 500g to 1kg containers. Condition your solder paste from the refrigerator to being prepared for production in about 10 minutes.
About Seika Machinery, Inc.
Seika Machinery, Inc. (SMI) is a subsidiary of Seika Corporation, Japan and member of the Mitsubishi Global Group. SMI provides electronics manufacturers with advanced machinery, superior materials and engineering services.