Saki’s Inspection Systems deliver position accuracy of 3 μm to 9 μm.
Press Release Summary:
Saki is offering 5th generation, 3D Automated Optical Inspection (AOI), 3D Solder Paste Inspection (SPI), and 3D Automated X-ray Inspection (AXI) systems. 3D AOI and SPI systems are available with resolutions of 7μm, 12μm, and 18μm and are used to inspect and measure as low 20 mm in height. 3D BF-3 AXI system can inspect voids inside solder joints of IGBT modules and provides 100% head-in-pillow detections.
Original Press Release:
Saki to Demonstrate AOI, SPI, and AXI Software and Systems at IPC APEX Booth 1127
Introduces Quality-Driven Production for M2M communication
Saki Corporation, an innovator in the field of automated optical and x-ray inspection and measurement systems, will demonstrate its new 5th generation, 3D Automated Optical Inspection (AOI), 3D Solder Paste Inspection (SPI), and 3D Automated X-ray Inspection (AXI) systems and software at the IPC APEX Expo, February 27-March 1, San Diego, California, Booth 1127. In addition, Saki's 3D AOI system, based on its Quality-Driven Production (QDP) concept for true closed-loop, machine-to-machine communication, will be part of the Fuji SMART Factory Line in booth 3539.
Saki's 3D AOI and SPI systems are the fastest and most accurate 3D inspection and measurement systems in the world, while maintaining position accuracy of 3μm to 9μm at 3σ for 99.7% positioning accuracy. These systems are the first to offer a choice of three resolutions-7μm, 12μm, and 18μm. They can inspect and measure all components, from the very smallest to components 20mm in height, come in both single and dual lanes, and handle all size boards.
For AXI, Saki's 3D BF-3 AXI system is the most accurate 3D AXI system available, achieving 100% head-in-pillow detection and enabling land grid array (LGA) inspection and measurement. It inspects for voids inside the solder joints of insulated gate bipolar transistor (IGBT) modules, which is especially important in the automotive industry.
Quality-Driven Production, Saki's tool for M2M communication, ensures that the data and information that is communicated to third party systems is valid and accurate. A self-diagnostic system with predictive and preventive maintenance management assures stable machine conditions and repeatable, consistent performance. Every key component is monitored, along with system conditions, and a detailed diagnostic log is recorded. Process stability is improved, productivity increased, and equipment operating costs reduced.
"We are excited to be exhibiting at IPC APEX this year," said Satoshi Otake, General Manager, SAKI Americas. "In addition to our new systems, Saki is unveiling and giving demonstrations of our totally new software system. We hope you will come to our booth and give it a try."
To sign up for a demonstration, go to http://www.sakiglobal.com/appt, and for more information, contact Saki at +1.510.623.SAKI (7254), email sales.us@sakiglobal.com, or visit our website at http://www.sakiglobal.com.
About Saki
Since its inception in 1994, Saki has led the way in the development of automated recognition through robotic vision technology. Saki's 3D automated solder paste, optical, and x-ray inspection systems (SPI, AOI, AXI) have been recognized to provide the stable platform and advanced data capture mechanisms necessary for true M2M communication, improving production, process efficiency, and product quality. Saki Corporation has headquarters in Tokyo, Japan with offices, sales, and support centers around the world.
