S2C Adds 7 New Prototype Ready(TM) Accessories to Its Suite of Rapid FPGA-Based Prototyping Tools


The New Accessories Help Speed Prototype Development and Interface Prototypes to the Target Operating Environment

San Jose, CA - S2C today announced that it has added 7 new Prototype Ready accessories to the already large family of daughter cards used to create FPGA-based prototypes and interface FPGA-based prototype boards to the user's target operating environment. These pre-engineered off-the-shelf solutions speed the overall prototype development schedule by saving the user the time to engineer the solutions on their own.

Mon-Ren Chene, S2C's Chairman and CTO said that many of our Prototype Ready solutions are developed in response to customer needs. "We take the "rapid" in rapid FPGA-based prototyping very seriously. We always work closely with our customers to identify new ways to save them time and to help them get to market sooner. Our success hinges upon our customer's success. In addition, we proactively develop new products and Prototype Ready IP and accessories to help improve our customer's rapid FPGA-based customer success."

Availability
The new Prototype Ready accessories are available today. Contact your local sales office for more information.

General Peripheral Modules
FTDI Interface Module
The FTDI Interface Module connects the TAI Logic Module to a FT4232H Mini Module and allows designers to quickly prove functionality of adding USB to a target design with I2C master, SPI master and UART ports.

2 Channel High Speed A/D and D/A Module
2 Channel High Speed A/D and D/A Module provides two 14-bit Analog to Digital (A/D) converter channels using TI's ADS4249 chip and two 14-bit Digital to Analog (D/A) converter channels using TI's DAC5688 chip. Occupies one TAI LM I/O connector.

SMA2SATA Module
SMA2SATA Module converts SATA interface to 2 pairs of SMA connectors.

Memory Modules
Multi-Function Flash Memory Module
Multi-Function Flash Memory Module supports one NAND Flash socket, one SPI Flash socket, one I2C EEPROM socket and one SD card socket. Occupies one TAI LM I/O connector.

4GB DDR3 Pre-tested SO-DIMM Memory Module
4GB DDR3 Pre-tested SO-DIMM Memory Module has been verified on V6 TAI Logic Module to perform out-of-box at up to 800Mbps data rate. Occupies one TAI LM DDR3 SO-DIMM socket.

General Expansion Modules
Global Clock Management Module
Global Clocks Management Module outputs 3 clocks (2 differential and 1 single-ended) and 1 reset signal with equal timing to up to 4 different boards through SMB connectors. All 3 clock frequencies can be conveniently programmed via USB from a PC or from external SMB inputs. The reset signal input can come from either an on-board push button or a SMB input.

Virtex-6 I/O Level Shifting Module Type C
Virtex-6 I/O Level Shifting Module Type C allows Virtex-6 TAI LM 2.5V IO to connect to 3.3V devices. Type C supports bi-direction translation and can work with connectors on top side of TAI Logic Module. Occupies one TAI LM I/O connector.

See the New Accessories at SoCIP
Please visit us at SoCIP on May 22 and May 24 to see these new products.

About S2C
Founded and headquartered in San Jose, California, S2C has been successfully delivering rapid SoC prototyping solutions since 2003. S2C provides:
  • Rapid FPGA-based SoC prototyping hardware and automation software
  • Prototype Ready(TM) IP, Platforms, and Accessories
  • System-level design verification and acceleration

    S2C's value is our singular focus on SoC/ASIC development. Our highly qualified engineering team and customer-focused sales force understands our customers' SoC development needs. S2C's unique FPGA-based solution, using our patented TAI IP technology, enables designers to quickly assemble FPGA-based SoC prototypes on S2C FPGA boards. This gives customers an early start on software development, typically the long pole item in development schedules. Combining rapid prototyping methodologies with a comprehensive portfolio of Prototype Ready IP and advanced verification and acceleration solutions, S2C solutions greatly reduces the SoC design cycle.

    In addition to the headquarters in San Jose, CA, S2C currently has 4 direct offices located in Shanghai, Beijing, Shenzhen China and HsinChu, Taiwan. S2C is also the organizer of the annual SoCIP conference and exhibition in China, which brings SoC designers from the Asia-Pacific region together with international silicon IP and SoC solution vendors. For more information, visit www.s2cinc.com.

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