NSX 330 Inspection Systems selected for large-scale ramp of package production
Flanders, New Jersey — Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a leading foundry in Asia has placed an order for over $15 million USD for multiple NSX® 330 Systems. The systems will be used for inspection of next-generation fan-out wafer level packaging products, including whole-wafer inspection and post-saw inspection. The systems will begin shipping in the fourth quarter of 2015 with the majority shipping in the first quarter of 2016.
"We are pleased to partner with this industry leader to provide the market-leading NSX System for their next-generation packaging line," said Mike Goodrich, vice president and general manager of Rudolph's Inspection Business Unit. "Key factors of this win were the systems' superior inspection sensitivity, capture rate, and throughput for two-dimensional (2D) inspection, while meeting the automation challenges inherent with fan-out wafers and film frames. Additionally, all systems will be equipped with Rudolph's Discover® Yield Management Software that enhances the user's process analysis capability in real-time, enabling fast yield improvement and increasing the productivity of each tool and the overall fab yield. This level of process visibility is quickly becoming essential to factory efficiency."
"Rudolph has been enabling its customers' development of advanced packaging processes for nearly two decades. We are pleased that our experience, combined with our unique fusion of hardware and software solutions, was selected to help our customer quickly ramp and control such a critical project," said Mike Plisinski, chief executive officer of Rudolph. "The development of advanced packaging solutions is a priority for many of our customers, as more of their customers specify packages utilizing fan-out, panel, and copper pillar technology to reduce the cost of devices while improving performance." Plisinski adds, "While the 2016 forecast for the overall semiconductor industry remains relatively subdued at 1.9 percent growth, according to Gartner, the development of next-generation advanced packaging processes continues to be an important growth driver for Rudolph. We are pleased that our comprehensive solutions—process, process control, and software—are helping to enable this growth."
The NSX family is the market leader for automated macro defect inspection for advanced packaging. The NSX 330 Series enables advanced packaging processes by directly improving the cost-of-ownership of multiple applications in a single platform. The NSX 330 Series boasts high-acceleration staging, high-speed multi-processor computing and flexible software with an unprecedented level of usability.
Discover YMS Software is Rudolph's in-line defect, metrology and data management system designed to enhance Rudolph's process analysis capability in real-time and post inspection analysis. While inspection and metrology systems provide a snapshot of the wafer or lots, limiting process correlation to a single event, Discover software collects individual tool results and provides an advanced statistical analysis of those results, allowing users to drill down into the data to reveal defect and metrology trends, wafer-level signatures, defect source analysis and metrology correlations. Discover software offers full characterization of inspection data, resulting in high productivity and demonstrable quality.
For more information about Rudolph's NSX systems and Discover software, please visit www.rudolphtech.com.
About Rudolph Technologies
Rudolph Technologies, Inc. is a leader in the design, development, manufacture and support of defect inspection, lithography, process control metrology, and data analysis systems and software used by semiconductor and advanced packaging device manufacturers worldwide. Rudolph delivers comprehensive solutions throughout the fab with its families of proprietary products that provide critical yield-enhancing information, enabling microelectronic device manufacturers to drive down costs and time to market of their devices. The Company's expanding portfolio of equipment and software provides comprehensive solutions for front-end wafer processing, final manufacturing and advanced packaging of ICs. Headquartered in Flanders, New Jersey, Rudolph supports its customers with a worldwide sales and service organization. Additional information can be found on the Company's website at www.rudolphtech.com.