Rochester Institute of Technology has partnered with equipment supplier MARTIN to utilize a MARTIN Expert 10.6 Rework Station and Mini-Oven unit in its Center for Electronics Manufacturing and Assembly (CEMA) located in Rochester, NY. The systems will be on hand to support CEMA in many ways, including hands-on education for students, industry workforce training, support of student projects and applied research. The center also will provide MARTIN the opportunity to showcase its equipment to many local and regional electronics packaging companies, and to conduct investigations to explore its suitability for customer applications.
"The addition of the Expert 10.6 and Mini-ovens is invaluable to the center. We welcome MARTIN's enthusiasm in partnering with CEMA. With their equipment support they have joined an impressive list of partners who have extended their support for many years," commented Dr. S. Manian Ramkumar Ph.D., CEMA's Director.
The Expert 10.6 system is capable of precision rework of SMDs, sockets and connectors, as well as residual solder removal and dispensing of fluxes and solder pastes. The hybrid platform combines both infrared and convection heating technologies to achieve outstanding board temperature uniformity.
The stand-alone Mini-Oven can repair a diverse range of BGAs as well as QFNs and CSPs. Using MARTIN's rapid technology, soldering profiles apply settings within the permitted thermal limits, heat at the highest advisable thermal ramp rates and maintain a safe temperature zone. For more information about MARTIN's Mini-Oven or Expert 10.6 Rework Station, visit www.bgarework.com.
MARTIN has developed affordable rework, BGA reballing and dispensing technologies for 30 years with a strong commitment to high quality, precision and reliability. The USA sales and service office is located in Manchester, NH. The company's manufacturing facility is in Wessling, Germany. MARTIN is a FINETECH company.
The Center for Electronics Manufacturing & Assembly (CEMA) is an academic research lab offering the Electronics Packaging industry research services, failure analysis, training, process development, consulting and laboratory rental. CEMA's mission is to be a quick turnaround, value added, electronics packaging service provider to companies and to enhance the performance of the partners through focused training and applied research.
Dr. S. Manian Ramkumar Ph.D.
Director - CEMA
Professor - Manufacturing & Mechanical
Engineering Technology/Packaging Science
Rochester Institute of Technology