Press Release Summary:
Suitable for use in unlicensed frequency bands ranging from 779–965 MHz, Model ZL70251 targets short-range wireless sensor products in industrial applications. Unit is fully functional over industrial temperature rangeÂ ofÂ -40 to 85Â°C, while still delivering peak power at 2 mA in both transmit and receive modes. Supplied in 3 x 2 mm chip scale package, ultra low power device requires only 2 external components, making it suitable for products with space constraints.
Original Press Release:
Microsemi Releases Ultra Low-power Sub-GHz Radio with Extended Temperature and Frequency Range
Next-generation 2mA Low-power Transceiver Supports Industrial Operating Temperatures and China Unlicensed Frequency Bands
ALISO VIEJO, Calif. -- Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced the ZL70251 ultra low-power (ULP) radio frequency (RF) transceiver with an extended temperature operating range of -40 degrees centigrade (C) to 85 degrees C for short-range wireless sensor products used in industrial applications. In addition, the next-generation transceiver now can be used in unlicensed frequency bands ranging from 779-965 megahertz (MHz), which broadens the scope of operation from the previously supported North American (915 MHz) and Europe (868 MHz) bands to include China's 779-787 MHz radio frequency spectrum.
"Extending the temperature range of our industry-leading low-power consumption radio allows us to address increasing demand for M2M low power nodes used in automation and industrial control applications," said Francois Pelletier, product marketing director of Microsemi's ULP product group. "Increasing our frequency band parameters also enable to broaden our geographic footprint and capitalize on growing market opportunities in China."
The ZL70251 is fully functional over the industrial temperature range, while still delivering the industry's lowest peak power at 2mA in both transmit and receive mode. This performance enables extremely low-power wireless nodes to operate in harsh environments. It is offered in a compact 3 millimeter (mm) x 2mm chip scale package (CSP) and requires only two external components, which makes it ideal for products with space constraints.
A suite of ZL70251 product development support tools are available, including an application development kit (ADK), a low-power wireless communication software code starter for point-to-point connections and wireless sensor reference designs based on coin cell batteries.
The new device is sampling now and will reach full production status in July 2013. For more information, or to obtain a sample, email email@example.com or contact your local distributor or Microsemi sales representative.
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for communications, defense & security, aerospace and industrial markets. Products include high-performance, radiation-hardened and highly reliable analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and voice processing devices; RF solutions; discrete components; security technologies and scalable anti-tamper products; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 3,000 employees globally. Learn more at www.microsemi.com.
Microsemi and the Microsemi logo are registered trademarks or service marks of Microsemi Corporation and/or its affiliates. Third-party trademarks and service marks mentioned herein are the property of their respective owners.
CONTACT: Gwen Carlson, Director of Corporate Communications, 949.380.6135; or Beth P. Quezada, Communications Specialist, 949.380.6102, Email: firstname.lastname@example.org
Web Site: http://www.microsemi.com