RF Module is designed for mobile WiMAX devices.

Press Release Summary:

Designed by using 90 nm CMOS process technology, Model MB86K71 supports MIMO technology, enabling high-speed and reliable wireless connections. With 5 and 10 MHz bandwidth, it has operating voltage of 1.2, 2.925, and 3.3 V, supports IEEE 802.16e-2005 transmission standard, and operates in 2.496-2.69 GHz RF band. Unit measures 15 x 15 x 1.5 mm, and includes 94 pins with 0.5 mm pitch each and 2 x 2 STC/MIMO antenna with impedance of 50 W.

Original Press Release:

Fujitsu Launches World's Smallest RF Module for Mobile WiMAX Devices

Supports MIMO technology enabling high-speed, reliable communication

Tokyo, February 7, 2008 - Fujitsu Limited today announced the launch of the world's smallest radio frequency (RF) module for mobile devices, which supports all of the RF circuitry necessary for Mobile WiMAX (*1), the highly anticipated next-generation broadband wireless technology. The new RF module, MB86K71, co-developed with Fujitsu Laboratories Limited, was designed using 90-nanometer CMOS process technology. Sample shipment is scheduled to start at the end of February 2008.

This new RF module from Fujitsu, the world's smallest to feature all of the RF circuits necessary for Mobile WiMAX devices including RF-IC (*2), antenna switches, a power amplifier, filters, and an oscillator circuit (*3), measures just 15mm x 15mm (height: 1.5mm) in dimension. Thus, this RF module will enable significant reduction of the form-factor of Mobile WiMAX devices. The new RF module supports MIMO (*4) technology, thereby enabling high-speed and reliable wireless connections that are essential for Mobile WiMAX devices. Furthermore, Fujitsu also verified that this RF module can be connected to Fujitsu's previously released Mobile WiMAX baseband chip (*5), MB86K21, enabling customers faster development and faster time to market of Mobile WiMAX devices through the use of both of these chips.

Fujitsu will exhibit this RF module at the Mobile World Congress 2008 to be held in Barcelona, Spain, from February 11-14, 2008 (Stand J45, Hall 1).

Mobile WiMAX is a next-generation broadband wireless technology featuring data transmission that is faster than that of 3G cellular networks, and wider coverage than existing wireless LANs. Mobile WiMAX service is scheduled to start in the U.S and Taiwan in 2008, followed by Japan where the service is scheduled to start in 2009. With this ramp-up of WiMAX, opportunities for new markets and services are expected to be created.

Fujitsu will continue to pursue the integration of baseband chips and RF modules, and in addition to adding products to its line-up which will feature even lower power consumption and smaller form-factors, Fujitsu aims to contribute to the expansion of the Mobile WiMAX market through the further miniaturisation of RF-IC.

Key Features

1. World's smallest RF module realised by utilising 90nm CMOS
process technology

With the RF-IC fabricated in 90nm CMOS process technology, combined with antenna switches, a power amplifier, filters, and an oscillator circuit, all the necessary RF circuits for a Mobile WiMAX device are in one module. Subsequently, the world's smallest size module was realised, with dimensions 15mm x 15mm (with height 1.5mm) which will contribute to a reduction in the form-factor of Mobile WiMAX devices.

2. High-speed, reliable connections using MIMO

This product supports MIMO, which utilises multiple antennae, to achieve high-speed and reliable wireless connections. This product also supports WiMAX Forum's Wave 2 (*6) specifications.

Sample Pricing and Shipment

Product  Sample Prices  Start of Sample Shipments
MB86K71 JPY5000 End of February 2008

Sales Target

Accumulated revenues of 5 billion yen (JPY) by the end of fiscal year 2010 (March 31, 2011).

Related Websites:

Fujitsu Limited - Microelectronics and Electronic Devices: www.fujitsu.com/microelectronics

Fujitsu Limited /WiMAX chips:

Related WiMAX baseband press release:

Glossary and Notes

*1. Mobile WiMAX:
Conforms to the IEEE 802.16e-2005 Mobile WiMAX standard.

*2. RF-IC:
Radio Frequency Integrated Circuit (high-frequency IC). A communication device that utilizes high-frequency bands to receive and transmit wireless signals, and processes analog signals.

*3. Oscillator circuit:
Refers to a voltage-controlled, temperature-compensated crystal oscillator.

*4. MIMO:
Multiple Input Multiple Output. A technology that uses multiple antennae at both the transmitter and receiver to improve high-speed communication performance.

*5. Baseband chip:
Circuits that process communications protocols for wireless networks.

*6. WiMAX Forum's Wave 2:
Certification testing by WiMAX Forum for Mobile WiMAX equipment using MIMO.

Key Specifications of the MB86K71 RF Module

Module Size
15mm x 15mm x 1.5mm

Pin Count
94 pins

Pin Pitch

Operating Voltage
1.2V/2.925V/3.3V (3 voltages)

RF band
2.496GHz ~ 2.69GHz

5MHz, 10MHz

Wireless Access Method
512/1024 FFT OFDMA

Modulation method
64QAM(*1), 16QAM, QPSK(*2)

2x2 STC/MIMO (supports MatrixA & MatrixB)

Antenna Impedance
50 Ohm

Antenna Diversity

Transmission Standard
IEEE 802.16e-2005

*1 QAM: Quadrature Amplitude Modulation. A digital modulation technique used in wireless communication.

*2 QPSK: Quadrature Phase Shift Keying. A digital modulation technique used in wireless communication.

Inquiries: www.fujitsu.com/global/news/contacts/

About Fujitsu Limited

Fujitsu is a leading provider of customer-focused IT and communications solutions for the global marketplace. Pace-setting device technologies, highly reliable computing and communications products, and a worldwide corps of systems and services experts uniquely position Fujitsu to deliver comprehensive solutions that create infinite possibilities for its customers' success. Headquartered in Tokyo, Fujitsu Limited (TSE:6702) reported consolidated revenues of 5.1 trillion yen (US$43.2 billion) for the fiscal year ended March 31, 2007. For more information, please visit www.fujitsu.com

Customer Contact:
Marketing Department
Mobile Solutions Division
Electronic Devices Business Unit
TEL: +81-3-5322-3381
Inquiries: http://edevice.fujitsu.com/en-qform.html

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