Press Release Summary:
Equipped with 1.3 million pixel, split-vision CCD camera and 15 in. 1080p HD display, RW1200 SMT/BGA Rework System handles boards up to 16.1 x 14.6 in. System features joystick-controlled zoom with 230x magnification, and LED lighting that provides ultra-clear, superimposed views of component leads and PCB solder pads. In conjunction with Z-axis drive mechanism and automatic height sensing, RW1200 provides Â±0.01 mm placement accuracy needed for 0.3 mm lead pitch ÂµBGAs and delicate QFPs.
Original Press Release:
All Purpose, High-Precision SMT/BGA Rework System Under $15K
Manncorp will introduce its exclusive, new RW1200 SMT/BGA Rework System at booth #3732 of the IPC APEX EXPO in San Diego, Feb. 24-26.
Designed to tackle today’s most challenging surface mount board repairs, Manncorp’s new RW1200 SMT/BGA Rework System includes capability that, until now, was only available in more costly high-end equipment. High-definition vision, rapid-response IR underheating, and ultra-precise component alignment are just a few exclusive features that allow the RW1200 to remove and replace the industry’s most advanced SMDs. Fully-equipped for less than $15K, the RW1200 handles boards up to 16.1" x 14.6" and sets new standards for quality, versatility, and affordability.
The RW1200 comes standard with a 1.3 million pixel, split-vision CCD camera and a 15” 1080p HD display. Joystick-controlled zoom with 230x magnification and high-brightness LED lighting provide ultra-clear, superimposed views of component leads and PCB solder pads for easy alignment using ultra-fine X, Y, and Θ axis micrometers. In conjunction with its high-precision Z-axis drive mechanism and automatic height sensing, the RW1200 provides the ±0.01mm placement accuracy needed for 0.3 mm (0.012") lead pitch µBGAs and delicate QFPs.
A full assortment of heater nozzles, in a variety of standard and custom sizes for components from 2 x 2 mm to 55 x 55 mm, direct up to 1200W of hot air from the upper heater to the component. Adjustable hot air flow control helps to prevent even the smallest chip components from shifting during reflow. The 1200W bottom heater, essential for BGA repair, is surrounded by a 2700W, rapid IR underheater that quickly and efficiently heats the entire bottom surface of the PCB to prevent board warpage, reduce cycle times, and limit temperature exposure.
The RW1200’s ergonomic design and user-friendly touchscreen control software are also Manncorp exclusives. Set temperature versus actual temperature profiles measured through the unit’s built-in thermocouple input can be recorded and exported to a flash drive connected to a USB port on the front of the machine.
For a limited time, Manncorp is offering free, on-site installation and training on the RW1200, which is also backed by a full two-year parts warranty and unlimited factory support.
For nearly five decades, Manncorp has supplied electronics manufacturers with the world’s best values in PCB assembly equipment, direct to the customer, at the industry’s most competitive prices, and with full service and support. Offices in three locations: East (Huntingdon Valley, PA), West (San Diego, CA) and Mexico. www.manncorp.com