Rework/Repair System features PC-based process control.
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Press Release Summary:
ThermoFlo 3000 BGA/CSP rework and repair equipment, featuring vision overlay system with independently controlled, dual color LED lighting, can accurately place area array devices with solder ball diameters as small as 4 mm. Its 400 W bottom-side heater and 1600 W top heater coupled with nozzle design ensures successful reflow and even heating. Up to 4 thermocouples may be connected to develop/verify profiles.Original Press Release:
PACE® Presents New BGA/CSP Rework and Repair Equipment
Laurel, MD....PACE introduces the ThermoFlo 3000, the next generation in BGA/CSP rework and repair equipment. The TF 3000 is ideal for post assembly rework and repair operations with unparalleled performance, flexibility, and ease of use. Featuring an advanced vision overlay system with independently controlled, dual color LED lighting, the TF 3000 can accurately place area array devices with solder ball diameters as small as 4
mils. The TF 3000 features PC based process control utilizing technologically advanced, yet user friendly, software. The 400 watt bottom-side heater and 1600 watt top heater coupled with a unique nozzle design ensures successful reflow and even heating time after time. Up to four thermocouples may be connected to develop/verify profiles. The unit is self-contained, eliminating the need for external air supply or vacuum connections. The PC
software allows for inspection systems, such as PACE's XR 3000 x-ray inspection system, to be fully integrated into the complete area array rework solution. The software also features process documentation and defect analysis reporting functions and remote access capability.
For more information or a free demonstration, contact PACE by telephone at 301 490 9860, by fax at 301 490 0193, or contact your local authorized PACE distributor. For a closer look at PACE products, visit our website at www.paceworldwide.com
