Reflow Oven suits mid-volume PCB assembly.
Press Release Summary:
Equipped with 10 reinforced PID temperature controllers in each of 5 upper and lower chambers, Model R-500 precisely profiles critical solder paste reflow parameters. Three thermocouple inputs are provided for real-time monitoring of component and PCB temperatures. Computer-controlled oven is available with 16 in. stainless steel mesh belt or combination mesh belt and stainless steel adjustable edge pin conveyor for double-sided boards.
Original Press Release:
Economical R-500 Lead-Free 5-Zone Reflow Oven for Mid-Volume PCB Assembly Requiring Total Process Control
Manncorp's latest equipment entry in the universal trend to lead-free soldering is the economical R-500 reflow oven. This system features 10 reinforced PID temperature controllers in each of the five upper and lower chambers to precisely profile critical solder paste reflow parameters. For added compatibility with the extremely high temperatures of lead-free, there are three thermocouple inputs for real-time monitoring of component and PCB temperatures. Additional thermal management is provided by controls for cooling zone temperature and belt speed. The computer-controlled R-500 is available with 16" stainless steel mesh belt or a combination mesh belt and stainless steel adjustable edge pin conveyor for double-sided boards. The system relies on forced air convection for uniform edge-to-edge heating and is said to be an ideal choice for short to mid-run, high-mix applications. "Insta-Quote(TM)" online pricing is available at manncorp.com or call 800.PIK.MANN (745.6266).
