Quick Turn Around, High Complexity PCBs in Prototype and Production Quantities Available from Endicott Interconnect Technologies, Inc.


ENDICOTT, NY- Today's OEMs are tasked with supplying higher performance products that require increasingly complex printed circuit boards (PCBs) while reducing cycle times and bringing products to market faster. This drives the need for quick turn PCB fabrication regardless of the complexity of the board, backed by advanced manufacturing processes and high mix production capabilities.

Endicott Interconnect Technologies, Inc. (EI), through its Quick Turn Around (QTA) capability, provides a wide range of prototype/new product introduction PCBs in the early design phase so that customers can stabilize new designs and then get them to market quickly.

"Due to an increase in demand in the defense/aerospace, IT/supercomputer, medical and ATE markets, we have created a separate and dedicated QTA fabrication line with its own set of equipment, processes and operations personnel," said Jeff Knight, Director of QTA Operations at EI. "We have invested in QTA capability in order to provide 5 to 15 day turn around times, including those PCBs requiring complex technologies, high layer counts, high density interconnect and advanced manufacturing processes. Early successes include wins with new customers as well as new opportunities with existing customers."

The attached photo shows an example of a fabricated QTA PCB. This is a 36 layer board with impedance control, gold surface finish, a 21:1 aspect ratio, depth controlled back drilling and pattern plating and was supplied in prototype quantities.

Once the prototype board is evaluated and approved by the customer, EI can seamlessly switch to production quantities, since its QTA line is a mirror image of the tools and processes employed in the standard fabrication line, which is widely recognized for producing outstanding PCB quality. In addition, the staff at EI can offer expertise in design for manufacturability and process optimization for improving yields and product reliability.

Customers can order a prototype in real time by sending data or a request for quote directly via email to quote@eitny.com.

About Endicott Interconnect Technologies

Endicott Interconnect Technologies, Inc., with headquarters in Endicott, NY, is a supplier of electronic interconnect solutions consisting of fabrication and assembly of complex printed circuit boards, advanced flip chip and wire bond semiconductor packaging as well as precision equipment manufacturing and integration. EI product lines meet the needs of markets including defense and aerospace, communications and computing, semiconductor, advanced test equipment, and medical, where highly reliable products built in robust manufacturing operations are critical for success. With more than 45 years experience in providing microelectronics solutions, the company brings to market a unique mix of leading edge technology and technical know how that provide customers with a time-to-market advantage and competitive differentiation. For more information about EI and its products, please visit www.endicottinterconnect.com.

For more information on the high performance, quick turn around PCBs available for your application, contact Endicott Interconnect Technologies, Inc., 1093 Clark Street, Endicott, New York 13760. Tel: 1-866-820-4820; Fax: 607-755-7000.

Company Contact:
Theresa Taro
Director of Marketing and Communications
Phone: (607) 755-1847
Theresa.Taro@eitny.com

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