- Company Marks Milestone in Advancement of Semiconductor Manufacturing -
SAN DIEGO, Aug. 1 /-- QUALCOMM Incorporated (NASDAQ:QCOM) today announced that its first chip leveraging 45 nanometer (nm) process technology has taped out. The next milestone in CMOS semiconductor manufacturing, 45 nm technology enables chips that feature higher speeds, lower power consumption and enhanced integration with reduced die cost by providing more die per wafer.
"QUALCOMM's synergistic relationship with strategic foundry partners continues to support our long history of technology innovation as we reach this milestone in leading-edge process technology," said Behrooz Abdi, senior vice president and general manager for QUALCOMM CDMA Technologies. "We look forward to enabling new classes of products at 45 nanometers and beyond, which will evolve the role of wireless in everyday life to a new level for people around the world."
QUALCOMM has taped out its product on a low power-optimized 45 nm process that utilizes advanced immersion lithography and very low k inter-metal dielectrics features. The technology provides competitive performance with significant cost efficiency, along with improved performance on leakage and integration. The Company has also begun development work on 40 nm process technology, which is expected to deliver even greater benefits in semiconductor performance, cost and efficiency.
Close collaboration with strategic technology and foundry partners is a key part of QUALCOMM's Integrated Fabless Manufacturing (IFM) business model, which delivers greater efficiencies and accelerated technology advancement to the industry.
QUALCOMM Incorporated (www.qualcomm.com) is a leader in developing and delivering innovative digital wireless communications products and services based on CDMA and other advanced technologies. Headquartered in San Diego, Calif., QUALCOMM is included in the S&P 500 Index and is a 2007 FORTUNE 500® company traded on The Nasdaq Stock Market® under the ticker symbol QCOM.
Except for the historical information contained herein, this news release contains forward-looking statements that are subject to risks and uncertainties, including the Company's ability to successfully design and have manufactured significant quantities of CDMA components on a timely and profitable basis, the extent and speed to which CDMA is deployed, change in economic conditions of the various markets the Company serves, as well as the other risks detailed from time to time in the Company's SEC reports, including the report on Form 10-K for the year ended September 24, 2006, and most recent Form 10-Q.
Source: QUALCOMM Incorporated
CONTACT: Kira Lee, QUALCOMM CDMA Technologies, +1-858-845-7571, firstname.lastname@example.org, or Tina Asmar, Corporate Communications, +1- 858-845-5959, email@example.com,all of QUALCOMM Incorporated
Web site: http://www.qualcomm.com/