Purging Compound purges soft-touch polymers.
Press Release Summary:
Dyna-Purge® K is suitable for injection molders and extruders processing soft-touch polymers at temperatures from 290-500°F. It loosens carbonized and degraded resins, as well as colors, while carrier matrix flushes away impurities. Thermoplastic compound is non-chemical and non-abrasive. It requires no soaking, mixing, waiting, or preparation. Since Dyna-Purge K is thermally stable, it offers unlimited shelf life.
Original Press Release:
Shuman Plastics to Introduce Dyna-Purge® K, the First Purging Compound Designed Specifically for Soft-Touch Polymers, at NPE-2003
(April 2003) - Responding to the growing use of "soft-touch" polymers (e.g. TPO, TPE, TPR), the Dyna-Purge Division of Shuman-Plastics, Inc., Buffalo, New York, introduces the first commercial purging compound specifically designed to purge soft-touch polymers. Dyna-Purge® K will be introduced to the plastics processing industry by the company at the National Plastics Exposition (NPE-2003), Booth #2013 McCormick Place South, in Chicago, June 23 - 27, 2003.
Dyna-Purge K is designed for injection molders and extruders processing soft-touch polymers at temperatures ranging from 290°F to 500°F (143°C to 260°C). According to Kenneth Shuman, Vice President of Shuman Plastics, the new thermoplastic purging compound was developed and field-tested with customers seeking an application-specific purging compound. Increased demand for more ergonomic, soft-touch products has led to processing changes such as over-molding and co-injection molding of soft-touch polymers onto other polymers. "These applications typically require numerous color changes, for which Dyna-Purge K purges faster and more economically than using in-house resins or other purging agents," Shuman said.
Dyna-Purge K softens, but never melts, flowing naturally through the screw and barrel, Dyna-Purge says. The thermoplastic compound loosens carbonized and degraded resins, as well as colors, while the carrier matrix flushes away impurities.
Since Dyna-Purge K cleans on the first pass, it minimizes machine downtime and reduces scrap, according to Tim Cutler, Dyna-Purge Business Manager. Dyna-Purge K is non-chemical and non-abrasive, so it does not cause wear on machines. It is pre-
packaged, ready-to-use, requiring no soaking, mixing, waiting, or preparation that adds hidden costs, according to the company. Introduced at the resident resin processing temperature, Dyna-Purge K does not require any machine adjustments for temperature
or RPM speed.
Only a small amount of Dyna-Purge K is required to purge effectively, and it is said to be safe and easy-to-use for operators, and safe for disposal. Since Dyna-Purge K is thermally stable, it has an unlimited shelf life. A fresh scent eliminates odors often associated with purging. Dyna-Purge K is one of 10 grades of Dyna-Purge commercial purging compounds, the first introduced more than 20 years ago. In can be used for injection molding or extrusion providing there is a minimum clearance of 0.03-inch (0.75mm) throughout the entire process, including the nozzle or die, Dyna-Purge states.
For literature and to order a free trial sample of Dyna-Purge K, visit the company's booth (#2013 South) at NPE, or contact Shuman Plastics, Inc., Cyna-Purge Division, 35 Neoga Street, Buffalo, NY 14043-3397. Phone: 716-685-2121. Fax: 716-685-3236. E-Mail: info@dynapurge.com. URL: www.DynaPurge.com.
