Profiling Instrument completes thermal profiling loop.
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Press Release Summary:
M.O.L.E.scan® provides profiling capabilities to reflow ovens and rework stations. Permanently attached to reflow or rework equipment, it is powered from user's PC. M.O.L.E.scan delivers real-time profile data at one second intervals. Features include Dynamic Prediction, built-in database of solder paste specifications, and analysis tools. Product to be profiled can be instrumented with up to 6 thermocouples plugged into integral profiler unit.Original Press Release:
New M.O.L.E.scan® Completes the Thermal Profiling Loop
Milwaukie, OR: ECD, worldwide leader in thermal profiling systems, is pleased to announce the availability of M.O.L.E.scan®, the latest addition to their family of renown M.O.L.E.® profiling products. M.O.L.E.scan is specifically designed to bring high end profiling capabilities to reflow ovens old or new and all rework stations at a price that will fit even the tightest budget.
M.O.L.E.scan is permanently attached to the reflow or rework equipment and powered from the users PC so it requires no batteries or battery charging. M.O.L.E.scan delivers profile data in real time at a one second interval so the user sees every profile as it is happening. Now, even the oldest models of reflow ovens can benefit from the latest profiling software features such as "Dynamic Prediction" for quick process setup, a built in database of solder paste specifications and the many powerful ECD analysis tools.
M.O.L.E.scan is very simple to use: Load the software and plug the M.O.L.E.scan cable into the PC. The product to be profiled can be instrumented with up to 6 thermocouples plugged into the integral profiler unit. The wired product is then either sent into the oven tunnel for profiling or placed onto the rework station. When completed, the sensor wires and product are retracted from the thermal process. M.O.L.E.scan provides perfect profiling for both process and product whether static or dynamic. Profile prediction eliminates guesswork and unnecessary repetition of the profiling process. Hours are saved in set up and product quality is substantially increased.
M.O.L.E.scan ships from stock for $2000 in single quantities. OEM quantity pricing is available. All data acquisition and analysis capabilities are cross compatible with other M.O.L.E. software if the user needs to transfer product data files to a newer oven working with a different level of controls.
Forfurther product information, contact:
(Rex Breunsbach)
(mailto:rex.breunsbach@ecd.com)
800-323-4548 ext. xxx / Fax: 503-659-4422
ECD, Inc., 4287-A S.E. International Way, Milwaukie, OR 97222-8825, USA
www.ecd.com
