Electrical / Electronic Probes
Probe suits BGA, LGA, QFN, and QFP packages.
Press Release Summary:
Designed for use with test sockets, miniature 0.4 mm Probe is available with 4-point crown, concave, or 120 single point tip. Geometry of tip is optimized to meet most application requirements. Higher force spring is available for lead-free and highly contaminated environments.
Original Press Release:
Synergetix Breaks the 0.4 mm Probe Barrier
Kansas City, KS-- Synergetix, designer of test sockets and custom interconnects, announce the development of a new 0.4 mm probe for test sockets.
The design marks a new milestone in the miniaturization required to meet the industry demand for smaller probes. The 0.4 mm probe employs the same design concept used in many of the Synergetix 0.5 mm solutions.
"With this design breakthrough, our probe engineers have extended our probe reliability, robustness, and performance to the 0.4 mm level," according to Jamie Andes, Semiconductor Product Manager for IDI/Synergetix. "As Wafer Level Packaging is becoming more and more popular, this solution is well suited to meet those applications where probe cards are not ideal."
The 0.4 mm probe solution is available for all the major packages, including BGAs, LGAs, QFNs, and QFPs.
Tip options include a 4-point crown, concave, and 120 single point. Tip geometry has been optimized to meet most application requirements. To achieve additional force, a higher force spring is also available. This is especially beneficial for lead-free and highly contaminated environments.
Synergetix, established in 1994, is a leader in the design and manufacture of custom interconnects including high performance test sockets for the semiconductor industry and product connectors for the medical, military, aerospace and telecommunications industries. For more information, contact Synergetix at (913) 342-0404, visit our web site at svnergetix.com, or email us at infoi@synergetix.com.
