Prepreg suits automotive PCB applications.
Press Release Summary:
Offering high temperature and voltage properties, thermally conductive and electrically insulating T-preg(TM) HTD is used to isolate copper circuit layers from aluminum or copper base plate when making metal-based PCBs. RoHS-compliant product has UL relative temperature index rating of 150°C. HTD boards and substrates are compatible with Sn-Pb and Pb-free solders as well as surface mount and chip and wire assembly processes.
Original Press Release:
Laird Technologies Introduces Thermally Conductive T-Preg(TM) HTD with High Operating Temperature and Voltage Ratings
Thermal Dielectric Used to Make Printed Circuit Boards and Substrates
ST. LOUIS - (May 15, 2006) - Laird Technologies, a leading designer and manufacturer of electromagnetic interference (EMI) shielding, thermal management, telematics, and wireless antenna solutions, introduced today its T-preg(TM) HTD, a thermally conductive, electrically insulating pre-preg with high temperature and voltage properties for use in printed circuit boards (PCBs) for automotive and motor control applications. T-preg HTD is RoHS compliant and uses an environmentally friendly manufacturing process.
Part of the Laird Technologies' T-lam(TM) line of products, the T-preg HTD is used to isolate copper circuit layers from an aluminum or copper base plate when making a metal-based PCB. It has a UL relative temperature index (RTI) rating of 150 C, the highest operating temperature rating available for a thermally conductive pre-preg substrate.
"The high operating temperature of the HTD extends Laird Technologies' position as a market leader in the thermally conductive pre-preg segment," said Michael Dreyer, vice president and general manager, Laird Technologies' Thermal Products Division. "Our customers have consistently asked us to supply a pre-preg with a higher operating temperature rating for the marketplace, and we have responded with the T-preg HTD product."
The T-preg HTD's pre-preg format allows the designer to improve the thermal performance of standard printed circuit boards or to create power substrates on metal base plates. T-preg HTD is compatible with other board materials and fabrication techniques. Furthermore, HTD boards and substrates are compatible with both Sn-Pb and Pb-free solders as well as with surface mount and chip and wire assembly processes.
"The high-temperature operation is particularly important to applications under the hood of an automobile, especially when attached to the engine," said Bob Kranz, product manager, Laird Technologies' Thermal Products Division. "The combination of high-temperature operation and high-voltage isolation delivers the performance required for the 240 and 480 volt commercial and industrial applications, like motor control and ballast lighting.
This product can be used for single or multilayer metal board construction. The T-preg HTD substrate costs 3 to 8 cents per square inch and is available in quantity now.
About Laird Technologies
Laird Technologies is the world's leading designer and manufacturer of electromagnetic interference [EMI] shielding, telematics, thermal management and wireless antenna solutions for the telecommunications, data-communications, computer, general electronics, network equipment, aerospace, defense, automotive and medical equipment industries.
For additional information or the name of your nearest Laird Technologies' representative:
Laird Technologies
Phone 1 + (800) 843-4556, 1 + (314) 344-9300
Fax 1 + (314) 344-9333
Internet www.lairdtech.com
E-mail sales@lairdtech.com
