Power Management IC targets 4G wireless applications.
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Press Release Summary:
Housed in 5.5 x 5.5 mm package with operating temperature of -40 to +125°C, Model MIC2829 incorporates 6 DC/DC buck converters, 11 LDOs, and digital level shifters for SIM Card support. Five LDOs provide output accuracy of ±3% and require only 40 µA of ground current to operate. Four of 6 converters incorporate HyperLight Load(TM) technology, which enables 87% efficiency at 1 mA. Supporting 100% duty cycle operation, remaining 2 DC/DC buck converters deliver greater than 96% efficiency.
Original Press Release:
Micrel Ushers in New 4G Wireless PMIC Era with Highly Integrated Power Management Solution
San Jose, Calif., - Micrel Inc., (Nasdaq:MCRL), an industry leader in analog, high bandwidth communications and Ethernet IC solutions, today launched the MIC2829, a highly integrated Power Management Integrated Circuit (PMIC) for 4G wireless applications. The device represents a complete power management solution providing power to processors, multi-standard RF (such as HEDGE/ LTE or WiMAX) transceivers and power amplifiers, memory, USB-PHY, associated I/O interfaces and other system requirements. Designed for 3G/4G (HEDGE/LTE and WiMAX) USB wireless applications, the MIC2829 is currently available in volume quantities. Samples can now be ordered on line on Micrel's web site at: www.micrel.com/ProductList.do .
"The MIC2829 is a complete 4G wireless system PMIC. This release to the market represents the beginning of a new level of integration for USB and embedded based LTE or WiMAX 4G standard based mobile communication devices," noted Andy Cowell, vice president of Micrel Analog marketing. "This product is the result of Micrel's focused efforts to revolutionize mainstream wireless PMICs."
Andy Khayat, director of Micrel's portable product group added, "The MIC2829 integrates all system power and analog functions supporting 4G wireless baseband, RF and digital/analog sub-systems into one IC. It features Micrel's HyperLight Load(TM) (HLL) DC converters that greatly extend battery life and Micrel's advanced LDO technologies for ultimate system performance."
The MIC2829 incorporates six DC/DC buck converters, eleven LDOs and digital level shifters for SIM Card support inside a single, compact package. Five general purpose LDOs provide low dropout, excellent output accuracy of ±3% and only require 40 micro amps of ground current for each to operate. The remaining six are high performance Low Noise Regulators (LNRs) and provide high PSRR and low output noise for sensitive RF subsystems. Each LNR requires only 20 micro Amps of ground current to operate.
Four of the six integrated DC/DC buck converters incorporate HyperLight Load(TM) (HLL) technology. Each of these buck regulators operate at high switching speed in PWM mode (4MHz/2.5MHz) and maintain high efficiency in light load conditions. The high speed PWM operation allows the use of very small inductors and capacitors minimizing board area while the HLL mode enables 87 percent efficiency at 1mA. HyperLight Load(TM) technology also has unmatched load transient response to support advance portable processor requirements. The remaining two DC/DC buck converters support 100 percent duty cycle operation and can deliver greater than 96 percent efficiency. The MIC2829 is available in both 76-pin 5.5mm x 5.5mm LGA and 85-bump 5.5mm x 5.5mm FBGA packages with an operating junction temperature range from -40 °C to +125 °C.
About Micrel
Micrel Inc. is a leading global manufacturer of high performance analog and high-speed mixed signal solutions. The Company's products include advanced mixed-signal, analog and power semiconductors; high performance communication, clock management, Ethernet switch and physical layer transceiver ICs. Company customers include leading manufacturers of enterprise, consumer, industrial, mobile, telecommunications, automotive, and computer products. Corporation headquarters and state-of-the-art wafer fabrication facilities are located in San Jose, CA, with regional sales and support offices and advanced technology design centers situated throughout the Americas, Europe and Asia. In addition, the Company maintains an extensive network of distributors and sales representatives worldwide.
