Pourable Epoxies suit moldmaking applications.

Press Release Summary:



High-Temp Moldmaker (C-1) heat-cured epoxy liquid maintains compressive strength to 36,500 psi at operating temperatures up to 500°F. It has pot life of 90 min and achieves functional cure in 24 hr. Aluminum Liquid (F-2) aluminum-filled epoxy has low viscosity that provides accurate reproduction of mold details on delicate or intricate parts. Cured molds withstand service temperatures up to 250°F. F-2 has pot life of 75 min, and achieves functional cure in 16 hr.



Original Press Release:



Pourable Epoxies For Moldmaking



DANVERS, MA - Devcon moldmaking compounds are low-viscosity epoxy formulations that mix and pour easily, fill voids completely, faithfully reproduce intricate details, and cure with minimal porosity. Aluminum Liquid (F-2) and High-Temp Moldmaker (C-1) are ideal for producing a wide range of molds, dies, patterns, holding fixtures, and cast parts.

High-Temp Moldmaker (C-1) is a heat-cured epoxy liquid that maintains exceptional compressive strength (to 36,500 psi) at operating temperatures up to 500° F. It degasses easily after mixing and is ideal for casting molds or dies to be used in vacuum forming or short-run injection molding. It has a pot life of 90 minutes and achieves functional cure in 24 hours.

Aluminum Liquid (F-2) aluminum-filled epoxy has a low viscosity that provides accurate reproduction of mold details on delicate or intricate parts. Cured molds, patterns, or holding fixture can be machined, drilled, or tapped and withstand service temperatures up to 250° F. Aluminum Liquid can also be used to repair punch and die assemblies. It has a pot life of 75 minutes, and achieves functional cure in 16 hours. Heated curing maximizes the compound's physical properties. This product qualifies under military specification MMM-A-1754.

For more information, contact David Bongiorni, Market Development Manager, Devcon, 30 Endicott Street, Danvers, MA 01923, Toll-Free: 1-800-933-8266, TEL: (978) 777-1100, FAX: (978) 774-0516, www.devcon.com.

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