Potting/Encapsulation Compound resists thermal shock.

Press Release Summary:




Two-component, epoxy-sealing EP110F6, for potting, encapsulation, and casting, has 1-2 mix ratio by weight and cures upon exposure to elevated temperatures. It provides electrical insulation and resists thermal cycling and shock. Medium-viscosity liquid passes Navy Hex Bar Test, MILI-16923C, consisting of 10 cycles from -55 to +155°C. It resists chemicals and adheres to wide range of substrates. It is typically cured in 3-5 hr at 125°C.



Original Press Release:



New Potting/Encapsulation Compound Resists Thermal Cycling and Shock



Master Bond Inc., Hackensack, N.J. has developed EP110F6, a new high performance epoxy sealing, potting, encapsulation and casting compound. Two component EP110F6 has a 1 to 2 mix ratio by weight and cures upoon exposure to elevated temperatures. It exhibits superior electrical insulation properties and
outstanding resistance to thermal cycling and shock. Most importantly, EP110F6 passes the Navy "Hex Bar" Test, MILI-16923C, consisting of 10 cycles from -55°C to +155°C.

Master Bond EP110F6 is a medium viscosity liquid and has good flowability. It is typically cured at 3-5 hours at 125°C. For enhanced performance properties a post cure at 150°C for 2-3 hours is suggested. EP110F6 resists a wide range of chemicals
and adheres well to a wide range of substrates. For a 200 gram mass of material the working life is 4-6 hours.

EP110F6 has an elongation of 102% and a Shore D hardness of 65. It's volume resistivity at 75°F is >1015 ohm-cm. Additionally it has a coefficient of thermal expansion of 80-90 in/inx 10-6/°C and a dielectric strength at 77°F of >440 volts/mil.

Master Bond EP110F6 is available for use in pint, quart, gallon and 5 gallon container units. The color of Part A is clear while the color of Part B is amber.

For further information, please contact:

James Brenner
Marketing Manager

Visit our WEBSITE at http:/www.masterbond.com Or E-Mail us at Main@Masterbond.com

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