Press Release Summary:
Designed to cure at room temperature, 2-component 20-2125 Potting, Encapsulating, and Casting Resin cushions and protects sensitive electronic components while imparting very little stress on components during cure or thermal cycling. Hardness can be modified by changing mix ratio of Polyol and Isocyanate. Moisture-resistant with low toxicity, product can be used in wet environments and minimizes employee exposure to dangerous chemicals.
Original Press Release:
Epoxies, Etc... Develops New Polyurethane Potting Compound That Allows End User to Adjust Hardness
Epoxies, Etc. develops a new Potting, Encapsulating, and Casting resin. The 20-2125 is a two-component, low viscosity, room temperature curing system. This is an easy to use polyurethane that will cushion and protect sensitive electronic components. It will impart very little stress on components during cure or thermal cycling due to its low durometer.
A unique feature of this product is the ability to modify the hardness by simply changing the mix ratio of the Polyol and Isocyanate.
Adjustable Hardness Durometer can be modified for different applications
Low Toxicity Reduce employee exposure to dangerous chemicals
Green Reduce demand on non-renewable fossil fuels
Low Viscosity Quick self leveling around components
Low Durometer Low stress on components & vibration resistant
Moisture Resistant Can be used in wet environments
Low Shrinkage & Exotherm Will not damage components during cure
Samples are available and may be requested from our website: www.epoxies.com