Plasma-Therm Receives a Repeat Multi-Module Versaline Order from Wireless Chip Manufacturer
St. Petersburg, FL - Plasma-Therm LLC, a global supplier of plasma process equipment, is pleased to announce the sale of another multi-chamber VERSALINE® production system for etch and deposition to a leading North American wireless compound semiconductor manufacturer.
The process modules include an Inductively Coupled Plasma (ICP) etcher for additional capacity for advanced backside GaAs via formation. A second module utilizes Plasma Enhanced Chemical Vapor Deposition (PECVD) for highly controllable, low damage, low stress silicon nitride deposition for demanding applications such as capacitors and passivation. Each process chamber includes Plasma-Therm's EndPointWorks® technology to ensure maximum via etch yield and real-time film thickness monitoring. These orders compliment an installed base of Plasma-Therm VERSALINE® and Versalock® equipment at this site.
"Plasma-Therm has been an integral equipment supplier for wireless chip manufacturers for many years. Repeat orders based on a history of reliable, superior performance affirm our abilities to providing outstanding solutions to challenging compound semiconductor manufacturing issues," explains Ed Ostan, Senior VP of Marketing. "Our wireless device manufacturing customers are attracted by the breadth and depth of our technology spanning etch and deposition processes and our collaborative efforts with customers to ensure maximum value."
About Plasma-Therm
Plasma-Therm is a U.S. manufacturer (est. 1974) of advanced plasma processing equipment focusing on specialty semiconductor markets including R&D, solid state lighting, data storage, renewable energy, MEMS, nanotechnology and compound semiconductor. Through a variety of configurations, their systems are used for etching and deposition applications. With sales and service locations throughout North America, Europe and Asia-Pacific Plasma-Therm meets the diverse needs of their global customer base.
