Photoimageable Pastes promote plasma TV picture quality.
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Press Release Summary:
Designed for metallization of front bus electrode used in plasma display panels (PDPs), 7th Generation (7G) DuPont(TM) Fodel® photoimageable thick-film pastes promote image quality while minimizing paste consumption and precious metal content. Lead (Pb)-free products provide scaleable process for fine-line patterning of conductor lines on plasma glass panels. They utilize black pigments to reduce Ru consumption by 80% (typ) in plasma TVs.
Original Press Release:
DuPont Microcircuit Materials Introduces 7G Fodel Pastes
DuPont Microcircuit Materials Enables Plasma Television Manufacturers to Improve Picture Quality and Expand Market with 7th Generation DuPont(TM) Fodel® Conductors
TOKYO, Japan, Jan 10, 2007 - DuPont Microcircuit Materials, part of DuPont Electronic Technologies, is introducing its 7th Generation (7G) of DuPont(TM) Fodel® photoimageable thick-film pastes for the metallization of the front bus electrode used in plasma display panels (PDPs). The 7G Fodel® pastes provide improved image quality and enable substantial cost reductions through lower paste consumption and reduced precious metal content. The 7G DuPont(TM) Fodel® photoimageable thick-film paste is fully lead free and provides the same cost-effective, high-performance metallization for PDPs expected from the industry-standard DuPont(TM) Fodel® system.
"The rapid growth in the PDP market has put pressure on suppliers to develop lower cost and higher performance materials solutions, including improved image quality through better bright and dark contrast and finer resolution for full high definition (Full HD) television," said Walt Cheng, global business director, DuPont Microcircuit Materials. "Customers using the 7G system have targeted reduced ruthenium (Ru) and other precious metal content, and lower paste usage as key strategies for cost reduction. Our 7G products allow PDP manufacturers to substantially reduce paste usage, to deliver world class image quality and finer line resolution for Full HD designs. We expect this to support the continued growth of the PDP industry and allow more consumers to enjoy the visual experience offered by high definition, flat panel plasma televisions."
The DuPont(TM) Fodel® photoimageable thick-film paste technology provides a simple, high yield and highly scaleable process for fine-line patterning of conductor lines on plasma glass panels. The newly launched 7G pastes utilize novel, patent pending black pigments developed by DuPont to reduce dependence on Ru and still achieve improved blackness and conductivity at lower paste usage. These innovations reduce Ru consumption by 80 percent in a typical plasma television compared to previous generation Fodel® pastes. Improvements in photopolymer technology give customers the ability to achieve finer line resolution at reduced fired thicknesses when using the 7G Fodel® system. Several customers are in the process of qualifying these products during 4Q 2006 and full-scale production is expected during 2007.
DuPont Microcircuit Materials has over 40 years of experience in the development, manufacture, sale, and support of specialized thick film compositions for a wide variety of electronic applications in the display, photovoltaic, automotive, biomedical, industrial, military, and telecommunications markets. For more information about DuPont(TM) Fodel® photoimageable thick-film pastes, contact DuPont Microcircuit Materials at 1-800-284-3382 or visit mcm.dupont.com. Microcircuit Materials is part of DuPont Electronic Technologies, a leading supplier of electronic materials, including materials for the fabrication and packaging of semiconductors, materials for hybrid, rigid and flexible circuits, and materials for advanced displays.
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