PCB Interconnect System features .0315 in. pitch.
Press Release Summary:
With .0315 in. micro pitch design, SEARAY™ Open Pin Field Array provides routing and grounding flexibility while saving PCB space. Interconnect system comes in 4 and 6 row designs with up to 180 I/Os and performance up to 14 GHz/28 Gbps. Offering stack heights of .276 and .394 in., array includes Edge Rate™ contact system and lead-free solder charge terminations.
Original Press Release:
New 0,80 mm Micro Pitch Open Pin Field Array Saves PCB Real Estate
Samtec’s newest SEARAY™ interconnect system offers high speed performance and the unparalleled grounding and routing flexibility of the popular .050” (1,27 mm) X .050” (1,27 mm) Open Pin Field SEARAY™, but with a 0,80 mm (.0315”) micro pitch design that requires 50% less board space.
Features:
• 4 and 6 row designs
• Up to 180 I/Os (pin counts to 300 I/Os are in design)
• Rugged, high cycle, Edge Rate™ contact systemÂ
• Low insertion and extraction forces
• 7,00 mm (.276") and 10,00 mm (.394") stack heights
• Lead-free solder charge terminationsÂ
Also Available
The High Speed, High Density SEARAY™ interconnect family includes a .050” (1,27mm) x .050” (1,27mm) Open Pin Field Array system with up to 500 I/Os (SEAM/SEAF Series). They are available with stack heights from 7,00 mm (.276”) to 17,5 mm (.689”), right angle designs for high speed micro backplane applications and a press-fit design (SEAMP Series) which eliminates processing concerns for BGA-style connectors .
The LPAM/LPAF Series SEARAY™ LP is a Low Profile, High Density Open Pin Field Array with a mated stack height as low as 4,00 mm (.157”). A mating high speed coax cable assembly (SEAC Series), an 85Ω Open Pin Field Array (SEAMI Series) and an 85Ω Open Pin Field riser system (SEAR) up to 40,00 mm (1.575”) are also available.
For more information please visit: http://www.samtec.com/highspeed/HD_Arrays.aspx
