Press Release Summary:
Correct-A-Chip Adapter converts 160-pin QFP package with .65 mm pin-to-pin spacing into 16-pin through-hole array. UL94V-0 rated unit is constructed with .062 in. thick, glass-filled FR-4 material with 1 oz copper traces. Male pins are brass alloy 360 per ASTM-B-16, plated with 200 Âµin. tin over 100 Âµin. nickel per QQ-N-290, and are both soldered and pressed into body.
Original Press Release:
Aries Announces New 160-Pin QFP Correct-A-Chip Adapter
Frenchtown, NJ, May 2005 -- Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, has announced the development of a new Correct-A-Chip adapter that converts a 160-pin QFP package with .65 mm pin-to-pin spacing into a 160-pin through-hole array. With this adapter, the QFP package can be used in boards designed for the through-hole footprint of a Yamaichi footprint socket, resulting in a more reliable connection than with a QFP socket.
The UL94V-0 rated adapter is constructed with a .062" thick, glass filled FR-4 material with 1 oz. copper traces. The male pins are brass alloy 360 per ASTM-B-16 plated with 200 u" tin over 100 u" nickel per QQ-N-290, and are both soldered and pressed into the body, providing a rugged and reliable solder connection. The extremely low profile of the adapter provides extra room for mounting the component in space-restricted applications.
This adapter is part of Aries' line of Correct-A-Chip intelligent connectors, which can modify and upgrade existing designs without changing existing PCB layouts.
Pricing for a Correct-A-Chip 160-306045-10 is $25 in quantities of 50. Delivery is three weeks ARO.
For additional information, contact Aries Electronics, Inc., P.O. Box 130, Frenchtown, NJ 08825. Tel: 908/996-6841; Fax: 908/996-3891; E-mail: firstname.lastname@example.org; Web: www.arieselec.com, Data sheet #18098 -arieselec.com/products/18098.pdf.
Headquartered in Frenchtown, NJ, Aries Electronics, Inc., manufactures an extremely broad range of custom and standard interconnection and packaging products for electronics. Industry leading products include Zero Insertion Force (ZIF) test sockets for DIP, PGA, PLCC and SOIC devices; the Correct-A-Chip(TM) product line of "intelligent connectors"; adapters and connectors; several patented concepts for BGA (ball grid array) and LGA (land grid array) sockets; and an extensive array of high frequency test and burn in sockets. The company also specializes in meeting custom requirements for its customers.