Press Release Summary:
The half-pitch mini-flat package, which includes HMHA281, HMHA2801, and HMHAA280 optocouplers, features 4 surface-mount leads on 0.05 in. spacing, and has 61% smaller
footprint than a 4-pin dual inline surface-mount package. Optocouplers consist of a single gallium arsenide infrared emitting diode (dc input), which drives a silicon phototransistor. Applications include telecommunications, power conversion, and industrial control processes.
Original Press Release:
NEW HALF-PITCH MINI-FLAT PACKAGE OPTOCOUPLERS HAVE 61% SMALLER FOOTPRINT THAN 4-PIN DIP
San Jose, CA-November 27, 2001-Fairchild Semiconductor International (NYSE: FCS) today announced the introduction of a
new half-pitch mini-flat package configuration for optocouplers.
The half-pitch mini-flat package features four surface mount leads on 0.05 inch (1.27mm) spacing, and has a 61% smaller
footprint than a four-pin dual inline surface mount package. This makes it ideal for telecommunications, power conversion, and
industrial control applications where small component size is crucial. The first products to be offered in the half-pitch mini-flat package are the HMHA281, HMHA2801, and HMHAA280 optocouplers.
Fairchild's HMHA series optocouplers consist of a single gallium arsenide infrared emitting diode (dc input) driving a silicon
phototransistor. The HMHA281 has a current transfer ratio (CTR) of 50-600% and the HMHA2801 has a CTR of 80-600% at a
forward current of 5mA. The HMHAA optocoupler consists of two gallium arsenide infrared emitting diodes, connected in
inverse parallel (ac input), driving a silicon phototransistor. The HMHAA280 has a CTR of 50-600%, at a forward current of ±5
The HMHA281, HMHA2801, and HMHAA280 optocouplers are available in tape and reel configuration, and they are direct
replacements for NEC, Sharp and Toshiba. All full-pitch and half-pitch mini-flat package optocouplers are BSI, CSA, UL, and