Press Release Summary:
Model R-SOA-EAM-1550 monolithically integrates semiconductor optical amplifier with reflective electro-absorption modulator, combining high optical gain with high-speed modulation. Unit also offers low sensitivity to input polarization, suiting it for DWDM transmission at speeds of 10 Gbps over fiber optic links of up to 80 km. It can be used across entire C-band and is compatible with HyBoardÂ® photonic integration platform.
Original Press Release:
CIP Technologies Releases Novel Monolithically Integrated Reflective SOA-EAM for WDM and DWDM Networks at ECOC
Martlesham Heath, UK, September 21, 2009 - CIP Technologies, a company with a long history of photonics innovation, today announced the release of major new product, the R-SOA-EAM-1550, at the ECOC 2009 conference in Vienna, Austria.
This novel device monolithically integrates a semiconductor optical amplifier with a reflective electro-absorption modulator, to combine high optical gain with high speed modulation capability. The R-SOA-EAM-1550 offers high output power, low power consumption, and low sensitivity to input polarisation, making it suitable for DWDM transmission at speeds of 10 Gb/s over fiber optic links of up to 80 km. The device is 'colorless' and a single device may be used across the entire C-band.
"Using colorless modulators with remote DWDM light sources is becoming a viable alternative to expensive tuneable lasers in WDM-PON and metro applications," commented David Smith, CTO of CIP Technologies. "This level of device performance represents a breakthrough that will simplify and cost-reduce future deployments."
The R-SOA-EAM-1550 also incorporates standardised design features to make it compatible with the CIP HyBoard® photonic integration platform. "This new device is an important addition to the toolkit of optical devices that will be integrated in the future", said Smith.
More details of the product will be available at the CIP exhibition booth #700 at ECOC and Optical Systems Manager, Dr Alistair Poustie, will present a related paper on September 23rd at 15:45 in session 8.6 of the ECOC conference.
Please contact CIP for pricing and availability information; www.ciphotonics.com
About CIP Technologies
CIP Technologies is the trading name of The Centre for Integrated Photonics Ltd, a world-renowned developer of advanced photonic hybrid integrated circuits and InP-based opto-electronic chips, devices, arrays and modules for the communications, defense and renewable energy markets. With integrated state-of-the-art research, fabrication, coating, test, validation and production facilities, as well as strategic partnerships with volume packaging providers, CIP Technologies develops the photonic products of tomorrow. CIP Technologies' uniquely broad range of competencies is based on world-renowned research, and includes III-V photonic materials, silicon micromachining, planar silica waveguides and network architecture design and analysis. For more information visit www.ciphotonics.com
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HyBoard is a registered trademark of CIP Technologies.