One-Component No Mix Epoxy features rapid cure properties.
Press Release Summary:
Used for bonding, sealing, potting, and encapsulation, EP3RR-80 cures in 45–50 min at 175°F or 25–30 min at 250°F. Thermally conductive, electrically insulative, and dimensionally stable compound forms bonds to metals, composites, ceramics, glass, and plastics. Working life is unlimited at ambient temperatures, and minimized exotherm enables curing in thicker sections up to and beyond ½ in. deep. Epoxy is resistant to water, oils, fuels, and other chemicals.
Original Press Release:
No Mix, Thermally Conductive, Electrically Insulative Epoxy System Cures Rapidly At 80°C
No Mix, Thermally Conductive, Electrically Insulative Epoxy System Cures Rapidly At 80°C
Developed for a variety of bonding, sealing, potting and encapsulation applications, Master Bond EP3RR-80 is a one component epoxy that offers user friendly handling. It has a moderate viscosity, good flow properties and an unlimited working life at ambient temperatures. Additionally, this system can be stored at 40-50°F and does not require freezing.
Unlike typical one part epoxies, EP3RR-80 will cure in 45-50 minutes at 80°C (175°F), or in 25-30 minutes at 250°F. It features low exotherm while curing enabling it to cure in thicker sections up to and beyond a 1/2 inch deep. This dimensionally stable compound forms high strength bonds to metals, composites, ceramics, glass and many plastics.
EP3RR-80 has superb electrical insulation characteristics and delivers a thermal conductivity of 5-6 BTU·in/(ft²•hr•Â°F) [0.72-0.87 W/(m•K) at 75°F. Resistance to water, oils, fuels and many other chemicals is outstanding. Service operating temperature range is -100°F to +350°F.
This compound is widely employed in the electronic, aerospace, specialty OEM and related industries. It is available for use in syringes as well as standard containers ranging from ½ pints to gallons.
Master Bond Flip Chip Adhesives
Well suited for flip chip underfill applications, Master Bond EP3RR-80 is a single component compound that cures rapidly at elevated temperatures. It offers thermally conductivity, electrical insulation and dimensional stability. Read more about Master Bond’s flip chip adhesives at http://www.masterbond.com/industries/underfill-encapsulants or contact Tech Support.
Phone: +1-201-343-8983
Fax: +1-201-343-2132
Email: technical@masterbond.com.
