Oclaro to Showcase Photonic Innovations at LASER World of PHOTONICS; Executives Give Presentations


SAN JOSE, Calif. - Oclaro, Inc. (Nasdaq: OCLR), a tier-one provider of optical communications and laser solutions, today announced that it will be showcasing its newest photonic innovations at next week's LASER World of PHOTONICS show in Munich in the Oclaro booth #469, Hall C1 in the New Munich Trade Fair Centre. The company will be unveiling new products in its high-powered laser diode families, announcing a revolutionary new design win in a high volume medical application, and outlining its complete portfolio of fiber laser solutions and how the company intends to continually raise the bar on fiber laser pricing, performance, footprint and quality.

In addition, Oclaro will be giving 2 presentations during the show. Details of these presentations are below:

Panel #1: Oclaro's Solutions for Fiber Laser Pumping

Presenter: Michael Atchley - Senior Manager, Product Marketing Monday, May 23, 2011 from 11:00 - 11:20 a.m. in Hall C2,

Date/Time: Stand C2.569

Topic: The fiber laser market is being driven by an increasing need for pumping with higher efficiency, brightness, power and cost competiveness. Fiber optics leaders such as Oclaro are delivering the innovative chip design to meet these demands. During this discussion, Oclaro will highlight how its chip evolution is driving more power and efficiency while higher levels of brightness are pushing the limits of optical packaging technology. With one of the industry's most expansive product portfolios, Oclaro will highlight how it is delivering the next generation laser diode solutions that meet the cost/performance needs, today and in the future.

Panel #2: Oclaro's High-Brightness Fiber Coupled Packaging

Presenter: Ed Wolak - Director, Advanced Product Development Thursday, May 26, 2011 from 11:00 - 11:20 a.m. in Hall B2,

Date/Time: Stand B2.421

Topic: During this industry presentation, Oclaro will provide a high-level overview of fiber coupling packaging concepts and explain the different approaches in the market today. The pros and cons of different packaging platforms will be discussed. In addition, Oclaro will describe its successful packaging strategy, which involves utilizing multiple options to deliver the best cost structure and highest level of performance and reliability to the customer.

About Oclaro

Oclaro, Inc. (NASDAQ: OCLR) is a tier-one provider of optical communications and laser components, modules and subsystems for a broad range of diverse markets, including telecommunications, industrial, scientific, consumer electronics, and medical. Oclaro is a global leader, dedicated to photonics innovation with cutting-edge research and development (R&D) and chip fabrication facilities in the U.K., Switzerland and Italy, and in-house and contract manufacturing sites in the U.S., Thailand and China. To support its diverse and global customer base, Oclaro maintains design, sales and service organizations in each of the major regions around the world. For more information visit www.oclaro.com.

SOURCE Oclaro, Inc.

CONTACT: CONTACT : Erika Powelson, Tanis Communications, Inc., +1-408-295-4309, ext. 110, erika.powelson@taniscomm.com

Web Site: www.oclaro.com

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