Novatec has announced plans to exhibit their continuing array of breakthrough production technologies at this year's Productronica exhibition in Munich November 13th - 16th. Located at Stand A4.303, the electronic assembly process specialist responsible for numerous globally recognized inventions will showcase yet another unique innovation.
The Novatec team on Stand A4.303 will be demonstrating their Memory Shape Tooling solution VacuNest. Productronica visitors will learn how VacuNest provides a unique solution to the problem of securely fixturing bottom side populated assemblies for printing, dispensing and placement. Novatec's Shape Memory Tooling eliminates the many drawbacks of dedicated tools and flexible pin alternatives while providing secure support that removes the risk of component damage due to point force pressures.
Each VacuNest module is a pliable anti-static chamber containing a foam former surrounded by polymer granules. The chamber can be quickly profiled to the shape of the underside of a populated board, and under vacuum that profile can be retained indefinitely. VacuNest modules are available in a range of sizes to accommodate boards up to 450mm x 450mm and printing, dispensing and placement machinery from any manufacturer
Novatec EAP is a research company that develops new technologies for the electronic assembly industry. Founded in 1995 Novatec has patented and licensed numerous renowned inventions, including the ProFlow and RheoPump enclosed print heads, Varidot/PumpPrint adhesive imaging and direct sphere transfer process for ball grid array manufacturing.
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