Non-Sag, Thermally Conductive Epoxy Adhesive

With thick paste consistency, Epoxyset's EB-403-1LV-T1 bonds to diverse substrates including metals, composites, glass, ceramics, rubbers, plastics and will not run or sag even when applied to vertical surfaces even at elevated temperatures. Bonds resist thermal cycling, autoclave, as well as chemicals, including water, oils, fuels, acids, bases, and salts. This one component epoxy requires no weighing or mixing and is available in ready to use 10oz cartridges. EB-403-1LV-T1 cures rapidly at elevated temperatures and is room temperature stable for 4 months. With a thermal conductivity of >1.5 W/mK, it can be used for thermal management of electronic components as well as dielectric layers in various applications. EB-403-1LV-T1 can withstand continuous temperatures of over 205°C and intermittently of 300°C.

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