New Thin Film Via from UltraSource
June 5, 2009- Hollis, NH-UltraSource, Inc. a supplier of custom thin film circuits and ceramic interconnect devices, has announced the release of the new UltraVia(TM). This addition to their UltraTechnologies product line, which consists of the UltraCapacitor(TM), the UltraBridge(TM), and the UltraInductor(TM), is the next generation of integrated thin film via connection technology. The UltraVia(TM) uses a unique process and provides void-free construction featuring a high quality bond of the gold plug material to the ceramic sidewall. The pure gold construction of the UltraVia(TM) allows for maximum thermal conductivity and superior electrical performance.
About UltraSource
Established in 1991, UltraSource, Inc. is dedicated to the design and manufacturing of custom thin film interconnects and planar fabrication technologies. UltraSource specializes in providing unique, multilayer solutions to RF and Microwave circuit design challenges. Their UltraProcess has led to the development of several state-of the art manufacturing solutions including: UltraBridges(TM)-a robust and cost effective alternative to air bridges; UltraCapacitors(TM)-integrated capacitors for dense circuit areas; and UltraInductors(TM)-high Q spiral inductors with low parasitic inductance. UltraSource is a recognized supplier to several hundred key military and commercial contractors who manufacture guidance, radar, avionics, optoelectronics, microwave, and wireless communication systems. Devices are offered in quantities from prototype through high volume.
