New SMT Discs Machined from Brass

Press Release Summary:

  • Includes 1593, 1618, 1625 and 1656-X SMT discs with diameters of 0.093", 0.118”, 0.125” and 0.156" respectively
  • Comes standard with a 10 u" hard gold finish with a nickel under-plate
  • Ideal for surface mount soldering and as the conductive mating surface for spring-loaded pins and connectors as well as test probes

Original Press Release:

Mill-Max Expands Low-profile Target Discs

Oyster Bay, NY, 16 June 2020 – Mill-Max Manufacturing Corp., Inc. expands its family of spring pin mating products, with four new series offering additional diameter and height options. These low profile SMT disc shaped terminals are perfect for applications where vertical space is at a premium.

The expanded series include the 1593-X, 1618-X, 1625-X, 1656-X SMT discs, with diameters of .093" (1,98 mm), .118” (3 mm), .125” (3.18 mm) and .156" (3.964 mm) respectively. Each series is precision machined from brass and comes standard with a 10 u" hard gold finish with a nickel under-plate and is available in four heights from .025" (,64 mm) to .055" (1,4 mm) in .010” (.254 mm) increments. Custom sizes are quickly and easily achievable via Mill-Max's high-speed precision-machining processes. Other plating options, such as thicker gold or other materials, are also available.

With flat surfaces on both sides, target discs are ideal for surface mount soldering and as the conductive mating surface for spring-loaded pins and connectors as well as test probes. The discs are typically placed on solder pasted PCB pads and then subjected to reflow soldering. Once soldered, the terminals are ready to be used as reliable, durable contact points.

For more information, please visit http://www.mill-max.com/PR698

About Mill-Max

Mill-Max is the leading US manufacturer of machined interconnect components with a vertically integrated manufacturing facility headquartered at 190 Pine Hollow Rd., Oyster Bay, NY 11771. Its full product line includes spring-loaded connectors, SIP, DIP, PGA and BGA sockets, board-to-board interconnects and pin headers, surface mount and custom products, PCB pins and receptacles, solder terminals, wrapost receptacles and terminals. The company’s complete manufacturing facility includes engineering, tooling, primary and secondary machining, stamping, plating, injection molding, and assembly.

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