New Rugged ECU Accelerates ADAS and Autonomous System Product Design

Press Release Summary:

  • RVP-TDA4Vx production-intent kit features TDA4VM SoC processor and configurable SerDes interface
  • Supports multiple SerDes capture streams with different transport protocols through its configurable personality card
  • Ideal for automated valet park, neural networks, video analytics, driver notification, multi-camera display, mirror replacement and sensor fusion applications

Original Press Release:

D3 Engineering Announces a DesignCore® Development Kit Designed Around The TDA4VM SoC Processor from Texas Instruments

Rochester, NY – January 8, 2020 – D3 Engineering, a Texas Instruments platinum design partner, announced their DesignCore® RVP-TDA4Vx Development Kit with rugged ECU. The DesignCore® RVP-TDA4Vx Rugged ECU accelerates ADAS and autonomous system product design­­­ through production. The production-intent kit features TI’s TDA4VM SoC processor and configurable SerDes interface. The RVP-TDA4Vx Development Kit will be available in 1Q2020.

Automotive applications include automated valet park, deep learning, neural networks, video analytics, object identification and tracking, collision avoidance, driver notification, multi-camera display, mirror replacement, driver and cabin monitoring, sensor fusion, in-vehicle infotainment, and telematics. ­­­­­­­­­­­­­­­

Other applications include autonomous guided vehicles, industrial vehicle systems, high MP cameras, safety and security critical systems, and sensor fusion (camera, radar, ultrasonic, and LIDAR).

Automotive intent SOM processor board, configurable baseboard and firmware

The SOM processor board features a TDA4VM SoC processor with internal Image Signal Processor (ISP). The SOM is optimized for automotive temperature ranges and environmental conditions.

The configurable baseboard supports multiple SerDes capture streams with different transport protocols through its configurable personality card. The default card supports eight 4Gbps FPD-LinkTM III channels. The video outputs feature FPD-LinkTM III technology and Display Port MST technology, supporting up to 4 serial displays. The system supports Hardware-in-the-Loop architectures via a CSI2-TX port. The baseboard also has an expansion interface, multiple connectivity options, and an automotive power design with reverse battery protection. The Development Kit ECU has a rugged enclosure for on-vehicle testing. Texas Instruments video from CES 2020

Firmware and software include D3’s advanced vision software framework along with Processor SDK RTOS Automotive (PSDKRA) and Processor SDK Linux Automotive (PSDKLA) from TI. The software packages together form a multi-processor software development platform. The software package provides a comprehensive set of software tools and components to help users develop and deploy their applications. Both PSDKLA and PSDKRA can be used together to implement various automotive use-cases.

Please contact sales@d3engineering.com to place your order.

About D3 Engineering

D3 Engineering provides embedded electronic design services and OEM products for original equipment manufacturers in the industrial, transportation, infrastructure and commercial sectors. Using its proven DesignCore® platforms and proven stage-gate development process, D3 Engineering helps its partners minimize the cost, schedule, and technical risks of new product development for performance-critical applications. D3 specializes in autonomous systems, embedded vision, and connected automation. The company provides hardware design, firmware design, validation testing, transition to production, and OEM products. Learn more at www.D3engineering.com.

Editor Contact:
Jerome Barczykowski
Product Line Manager, Autonomous Systems
D3 Engineering
(585) 429-1550
press@d3engineering.com

Reader Contact:
Sales Manager
(585) 429-1550
sales@d3engineering.com

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